180-210℃ Thermoexpandable Microspheres CAS 38742-70-0 are high-temperature foaming additives developed specially for cable filling compound. Microspheres expand stably within 180–210 ℃ processing range to form fine closed-cell structure inside filling materials. It effectively lowers density, realizes lightweight and cuts raw material costs, while maintaining good flexibility, heat resistance and dimensional stability of cable filling compound. Featuring outstanding high-temperature resistance,

Product Detail

180-210℃ Thermoexpandable Microspheres CAS 38742-70-0 Cable Filling Compound Lightweight Additive

Product Overview

180-210℃ Thermoexpandable Microspheres CAS 38742-70-0 are high-temperature resistant physical foaming and lightweight additives specially formulated for cable filling compound processing. Designed to match the high-temperature production process of power cables and communication cables, the microspheres achieve stable and uniform thermal expansion within 180–210℃ temperature window. They form fine, independent closed-cell structures inside cable filling materials, effectively reducing overall density and realizing lightweight modification. The product significantly lowers raw material consumption and production costs while maintaining excellent flexibility, heat resistance and structural stability of cable filling compound. Featuring low water absorption, superior material compatibility and consistent batch foaming performance, it is a reliable functional additive for high-performance cable filling materials.

Core Features

High Temperature Resistance & Stable Foaming: Customized 180–210℃ expansion window perfectly matches cable material high-temperature extrusion and filling processes. Microspheres expand fully and evenly without rupture or shrinkage, adapting to continuous industrial cable production.

Efficient Lightweight & Cost Reduction: Uniform closed-cell structure greatly reduces the weight and density of cable filling compound. It effectively saves raw material usage, lowers overall production cost without compromising cable physical performance.

Low Water Absorption & High Insulation: Dense closed pores prevent moisture penetration, endowing cable filling materials with excellent water resistance and stable electrical insulation performance. It improves cable safety and long-term service reliability.

Excellent Cable Material Compatibility: Ultra-fine powder features outstanding dispersion in various cable filling compounds, rubber and plastic cable materials. No agglomeration or precipitation, no negative impact on material flexibility, tensile property and surface finish.

Enhanced Structural Stability: Effectively relieves internal stress of cable filling layers, improves flexibility and compression resistance. Prevents cable deformation and ensures stable filling structure during long-term laying and operation.

Eco-Friendly Physical Foaming: Adopts pure physical thermal expansion principle, no chemical decomposition, no harmful residues, low odor and low VOC. Fully compliant with environmental and safety standards for wire and cable materials.

Product Specifications

Product Name: 180-210℃ High Temperature Thermoexpandable Microspheres

CAS No: 38742-70-0

Product Type: Cable Filling Compound Foaming Agent / Lightweight Functional Additive

Foaming Temperature Range: 180℃–210℃

Appearance: White Ultra-Fine Powder

Applicable Materials: Cable filling compound, power cable and communication cable auxiliary materials, thermoplastic cable materials

Core Function: Cable material foaming, lightweight modification, density reduction, water resistance improvement, cost saving

Recommended Dosage: 1.0%–3.5% (Adjustable according to lightweight and filling performance requirements)

Application Scope

Widely used in lightweight foaming modification of various wire and cable filling materials. Suitable for power cable filling compound, communication cable filling materials, high-temperature resistant cable auxiliary materials and special cable insulation filling layers. It is widely applied in power engineering, communication transmission equipment, industrial wiring and automotive cable manufacturing fields.

Usage Guide

Mix thermoexpandable microspheres evenly with cable filling raw materials through low-speed stirring at room temperature. Avoid high-speed shear stirring and long-term high-temperature preheating to prevent microsphere damage and premature foaming. After uniform dispersion, carry out conventional cable compound mixing, extrusion and filling production. Complete stable thermal expansion and closed-cell forming during 180–210℃ high-temperature processing. Adjust microsphere dosage and processing temperature appropriately according to target lightweight degree and cable performance standards. Keep sealed and moisture-proof during production and storage.

Packaging & Storage

Packaging: 25kg sealed moisture-proof composite bag with inner PE liner, dust-proof and leak-proof, suitable for industrial bulk supply and long-distance transportation.

Storage: Store in a dry, cool and ventilated warehouse, keep tightly sealed at all times. Avoid direct sunlight, high-temperature stacking and humid environment to prevent microsphere caking and spontaneous foaming. Standard shelf life is 12 months under proper storage conditions.

Our Advantages

Our 180-210℃ thermoexpandable microspheres feature accurate high-temperature foaming window, stable expansion ratio and professional customization for cable filling materials. The product can form uniform closed-cell structure, effectively realizing lightweight, cost reduction, water resistance and insulation improvement for cable filling compound. We support factory direct sales, stable bulk supply, free sample testing and professional cable material formula technical guidance to help customers optimize product performance and market competitiveness.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.