CPO Encapsulation Filler is a multi‑modal blended inorganic filler composed of spherical silica and spherical alumina fractions with different particle‑size distributions. Optimized particle‑size grading enables high loading within epoxy molding compound. This filler features low coefficient of thermal expansion and improved thermal conductivity. It is used for EMC general filling to reinforce CPO encapsulation systems, reducing thermal‑induced stress and enhancing long‑term reliability of co‑pa

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Product Detail PageCPO Encapsulation Filler Spherical Silica‑Alumina Blend Multi‑Modal, Low‑Expansion High‑Thermal for EMC General FillingThis multi‑modal spherical silica‑alumina blend filler is produced by precise proportioning of flame‑synthesized spherical silica and high‑temperature‑fused spherical alumina powders of distinct particle‑size ranges. Strict mixing and homogenization procedures guarantee homogeneous distribution of two mineral phases across finished batches. Metallic and ionic impurities are tightly controlled to satisfy electronic‑grade specifications for semiconductor and optoelectronic encapsulation. Multi‑modal particle‑size grading allows finer particles to fill interstitial voids formed between larger spherical grains.

When incorporated into epoxy molding compound for CPO encapsulation, the multi‑modal grading significantly raises maximum filler loading without causing excessive melt viscosity. Higher inorganic loading reduces overall coefficient of thermal expansion of cured EMC matrix, which narrows the CTE mismatch between molding compound, silicon photonic chips and organic substrates. Consequently, thermal‑cycling‑generated interfacial stress is effectively mitigated, decreasing the probability of package warpage, interfacial delamination and micro‑crack initiation inside CPO modules during server operation.

Compared with pure spherical silica filler, the addition of spherical alumina fraction improves bulk thermal conductivity of the cured molding compound. Enhanced heat dissipation capacity facilitates removal of accumulated heat generated from high‑speed photonic and electronic components within dense CPO assemblies, lowering local hot‑spot temperature and slowing thermally driven material aging. The spherical particle morphology minimizes abrasion to extruder barrels, mixing screws and molding dies during EMC compound manufacturing and transfer‑molding production cycles.

This blended filler can be further treated with silane coupling agents. Surface modification improves interfacial adhesion between inorganic filler surfaces and epoxy polymer networks, suppressing micro‑void formation at phase boundaries and enhancing moisture‑resistance of the final EMC composite. Formulators can adjust the silica‑to‑alumina weight ratio and multi‑modal particle grading to tailor CTE, thermal conductivity and rheological characteristics for different CPO‑targeted EMC formulations.

The filler shall be stored in hermetically sealed dry containers to avoid moisture absorption and agglomeration. During material weighing, pneumatic conveying and batching operations, cross‑contamination by irregular sharp‑edged mineral powders must be prevented. Foreign angular grit would increase equipment abrasion and deteriorate the rheological property of epoxy molding compound. This multi‑modal spherical silica‑alumina blended inorganic filler serves as a key reinforcing and thermally conductive filling material for general‑grade EMC applied in high‑reliability CPO co‑packaged optics encapsulation.

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CPO Encapsulation Filler Spherical Silica-Alumina Blend Multi-Modal, Low-Expansion High-Thermal for EMC General Filling

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.