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DOPO Flame Retardant for LED Encapsulation CAS 35948-25-5, High Purity Halogen-Free for Epoxy Molding Compound

DOPO flame retardant (CAS 35948-25-5), chemical name 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, is high purity reactive halogen-free organophosphorus powder. It is specially developed for LED encapsulation and epoxy molding compound. The active P-H group can react with epoxy resin during curing and covalently attach to polymer network. It will not migrate or precipitate on the surface of LED encapsulation parts. It maintains low discoloration, good thermal stability and insulation prope

Product DetailsChemical IdentityProduct Name: 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, DOPO CAS No.: 35948-25-5 Chemical Type: Reactive halogen-free organophosphorus compound Physical Form: White crystalline powder Core Feature: High purity halogen-free for LED encapsulation and epoxy molding compound

Key Performance & TDSThis high purity DOPO has low impurity content, reducing yellowing risk of LED epoxy molding compound under long-term light and heat aging. Its reactive P-H bond participates in epoxy crosslinking reaction, locking phosphorus structure permanently inside cured resin without blooming. It delivers efficient flame retardant effect and helps epoxy molding compound reach UL94 V-0 rating. It has outstanding thermal stability and low smoke emission upon combustion. Halogen-free composition avoids corrosive gas release in fire. It keeps good electrical insulation and mechanical properties required for LED packaging components. Fine crystalline powder ensures uniform dispersion inside epoxy molding compound during mixing.

Applications

  • LED encapsulation epoxy molding compound
  • Epoxy packaging material for LED chips
  • Halogen-free thermosetting epoxy for optoelectronic packaging
  • Electronic component epoxy molding compound
  • Optoelectronic packaging resin requiring non-migratory flame retardancy

ComplianceThis product complies with RoHS and REACH regulations, suitable for global export optoelectronic packaging raw material projects.

Why Choose JSYWe supply factory direct high purity DOPO flame retardant for LED encapsulation and epoxy molding compound. Stable batch quality, low impurity, flexible MOQ and professional formulation support for optoelectronic packaging manufacturers.


DOPO Flame Retardant for LED Encapsulation CAS 35948-25-5, High Purity Halogen-Free for Epoxy Molding Compound
DOPO flame retardant (CAS 35948-25-5), chemical name 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, is high purity reactive halogen-free organophosphorus powder. It is specially developed for LED encapsulation and epoxy molding compound. The active P-H group can react with epoxy resin during curing and covalently attach to polymer network. It will not migrate or precipitate on the surface of LED encapsulation parts. It maintains low discoloration, good thermal stability and insulation prope
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DOPO Flame Retardant for LED Encapsulation CAS 35948-25-5, High Purity Halogen-Free for Epoxy Molding Compound

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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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