DOPO Reactive Flame Retardant CAS 35948-25-5, Halogen-Free Phosphorus for Electronic Encapsulation Copper Clad Laminate
DOPO reactive flame retardant (CAS 35948-25-5), 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, is reactive halogen-free organophosphorus flame retardant. It contains active P-H bond which can participate in epoxy curing reaction and graft into polymer backbone permanently. It will not migrate or bloom on the product surface. This grade is designed for electronic encapsulation compound and copper clad laminate, preserving good dielectric performance and thermal stability for electronic mater
Product DetailsChemical IdentityProduct Name: 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, DOPO CAS No.: 35948-25-5 Chemical Type: Reactive halogen-free organophosphorus compound Physical Form: White crystalline powder Core Feature: Reactive halogen-free phosphorus for electronic encapsulation and CCL
Key Performance & TDSDOPO’s reactive P-H group covalently links with epoxy resin during crosslinking, eliminating flame retardant migration problem that exists in ordinary additive flame retardants. It imparts outstanding flame retardant property, helping cured epoxy material reach UL94 V-0 level. It maintains excellent thermal stability and high glass transition temperature. Low smoke release and halogen-free composition prevent corrosive gas when burning, protecting electronic circuits. It retains stable dielectric properties required for copper clad laminate and electronic encapsulation materials.
Applications
- Epoxy resin for copper clad laminate production
- Electronic encapsulation epoxy compound
- Prepreg resin for PCB substrate
- High performance halogen-free electronic thermosetting material
- Semiconductor and electronic component encapsulation formula
ComplianceThis product complies with RoHS and REACH standards, fit for global export electronic raw material projects.
Why Choose JSYWe supply factory direct DOPO reactive flame retardant for electronic encapsulation and CCL. Stable batch quality, flexible MOQ and professional formulation guidance for electronic epoxy system development.
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