300cst Epoxy Modified Silicone (CAS 67762-96-3) is reactive epoxy grafted polysiloxane. Flexible silicone chains are chemically integrated into epoxy crosslink network during curing. It relieves curing shrinkage stress of epoxy resin, significantly enhances material toughness, lowers internal stress and prevents cracking under temperature cycling. Widely adopted toughening additive for epoxy electronic encapsulation and potting materials.

Product Detail

Product Overview

300cst Epoxy Modified Silicone (CAS 67762-96-3) is specially developed reactive silicone toughener for electronic grade epoxy packaging systems. The molecular structure combines flexible siloxane backbone and reactive epoxy groups. Unlike non-reactive silicone additives, it avoids phase separation and migration. It disperses uniformly inside epoxy resin to form stress buffer domains, solving the industry problem that neat epoxy resin is brittle and easy to crack after temperature change.

Key Features

Reactive epoxy functional groups, good compatibility with various epoxy resin systems
Excellent toughening effect, reduce brittleness and resist thermal cycling cracking
Effectively relieve curing shrinkage stress of electronic potting epoxy
Maintain good electrical insulation performance after curing
Low viscosity, convenient feeding and uniform dispersion during formula mixing

Main Applications

Toughening agent for epoxy electronic component potting compound
Stress relief additive for circuit board epoxy encapsulation resin
Modifier for power module, sensor epoxy packaging material
Flexible toughener for electronic insulation epoxy casting resin

Usage Guidance

Recommended dosage: 3%–12% based on total epoxy formula. Mix uniformly with resin component before adding curing agent. Conduct testing on toughness, insulation property and curing condition prior to mass production. Adjust dosage according to anti-cracking requirements.

Storage & Package

Seal drums tightly. Store in cool, dry and ventilated warehouse, avoid high temperature and direct sunlight. Standard package: 200kg iron drum. Shelf life: 12 months under proper storage conditions.

Service Support

Test samples are available for electronic material laboratory testing. Stable bulk supply and epoxy formulation technical support. Welcome to inquire TDS, COA and factory quotation.

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Epoxy Modified Silicone 300cst CAS 67762-96-3 Toughening Agent for Epoxy Resin Electronic Packaging

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.