White fused alumina powder, CAS 1344‑28‑1. It is produced by electric‑arc high‑temperature fusion, crushing, milling and precise classification. This high‑hardness α‑alumina powder possesses sharp angular crystal grains. It functions both as lapping abrasive powder for electronic ceramic and rigid inorganic filler for CPO semiconductor packaging composites, providing abrasive cutting action for precision grinding and enhancing mechanical rigidity of cured polymer‑based electronic components.

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Product Detail PageFused Alumina Powder White Fused Alumina CAS 1344‑28‑1, High‑Hardness for Lapping Electronic Ceramic & CPO FillerWhite fused alumina powder is manufactured by electric‑arc melting of high‑purity alumina raw materials at extremely high temperature, followed by solidification, controlled crushing, fine milling and multi‑stage particle classification. The final product consists of angular, sharp‑edged α‑alumina crystalline grains with outstanding hardness, high compressive strength and excellent chemical inertness. Strict particle‑size classification removes oversized lumps and excessive ultrafine dust fraction to guarantee consistent grain‑size distribution for both abrasive and filler applications.

For electronic ceramic lapping processes, the sharp hard alumina grains deliver uniform micro‑cutting action during precision grinding and surface finishing. It removes surface defects, reduces surface roughness of ceramic substrates, insulating ceramic chips and ceramic carriers used within semiconductor assemblies. The consistent grain hardness ensures stable lapping efficiency and avoids excessive deep scratches that would deteriorate the performance of precision electronic ceramic parts.

When deployed as inorganic filler for CPO semiconductor packaging composites, the rigid angular fused alumina particles reinforce the polymer matrix. It elevates the hardness, flexural modulus and abrasion resistance of cured encapsulation and structural resin composites, and reduces the thermal expansion coefficient of the finished electronic components. Nevertheless, its angular particle morphology brings higher abrasiveness to processing equipment. Therefore, wear‑resistant screws, barrels and moulds are required during compounding and molding production.

Impurity levels are closely controlled to restrict mobile alkali‑metal content, lowering the risk of electrochemical migration under high‑temperature and humid service conditions for CPO packaging modules. This white fused alumina shows baseline compatibility with epoxy and thermoset resin systems. Custom silane surface modification can be implemented upon request to improve interfacial adhesion between angular alumina grains and polymer matrix, enhancing the moisture‑resistant property and mechanical strength of cured resin composites.

It can be blended with spherical or calcined alumina grades to adjust overall composite rigidity, abrasiveness and rheological characteristics for custom CPO formulation development. The powder must be stored in hermetically sealed dry packaging to prevent moisture absorption. During weighing, conveying and batching procedures, cross‑contamination with soft calcined alumina or low‑purity brown fused alumina must be strictly prevented, otherwise lapping performance and electronic‑grade purity specifications will be compromised. This high‑hardness white fused alumina powder serves as a multi‑functional material for electronic ceramic precision lapping and reinforcing inorganic filler for CPO semiconductor packaging composites.

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Fused Alumina Powder White Fused Alumina CAS 1344-28-1, High-Hardness for Lapping Electronic Ceramic & CPO Filler

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.