Hexagonal Boron Nitride Powder (h‑BN) is synthetic lamellar boron‑nitride ceramic powder produced by high‑temperature solid‑phase synthesis, purification, milling and classification, followed by silane‑coupling‑agent surface modification. Featuring unique platelet‑shaped crystal morphology, this material combines excellent thermal conductivity, superior electrical insulation and stable high‑temperature chemical inertness. After silane modification, the powder achieves improved dispersion and int

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Product DetailsThis silane‑modified hexagonal boron nitride powder is manufactured via high‑temperature calcination synthesis. The crude h‑BN clinker undergoes crushing, fine milling and multi‑stage air classification. Strict particle‑size screening removes coarse agglomerated particles that may damage thin‑layer electronic components. The qualified lamellar powder then proceeds to dry silane surface‑modification treatment.

Untreated h‑BN powder shows relatively inert surface. When directly compounded with epoxy, silicone or thermoplastic resins, insufficient interfacial bonding between boron‑nitride platelets and polymer matrix tends to cause poor dispersion, void formation inside composite materials, and limited improvement on thermal conductivity. Silane modification forms a thin organic coupling layer on the platelet surface. It enhances wettability between h‑BN particles and molten or liquid resin during compounding, reduces void generation and strengthens the mineral‑polymer interfacial connection.

The typical lamellar platelet structure enables the formation of continuous heat‑transfer pathways inside the composite system. The overlapping boron‑nitride flakes construct directional thermal conduction networks, facilitating rapid heat dissipation from heat‑generating electronic parts. Meanwhile, h‑BN maintains outstanding electrical insulating performance and high dielectric strength, avoiding electrical short‑circuit risks for electronic assemblies. The product also possesses excellent oxidation resistance at elevated temperature, low dielectric loss and stable chemical inertness against most resins. It will not decompose or degrade under normal working temperatures of electronic thermal‑management components.

Proper particle‑size grading of h‑BN is critical for building effective thermal conduction networks. Formulation trials are recommended to optimize loading dosage according to resin system requirements. Excessive filler addition may increase melt viscosity and impair processing fluidity.

Typical application fields include thermally conductive silicone potting compounds, epoxy encapsulants, thermally conductive engineering plastics, thermal interface sheets, semiconductor module packaging materials and high‑voltage electronic insulation composites.

Packaging adopts 25 kg moisture‑proof aluminum‑plastic composite bags lined with inner polyethylene bags. Keep packages tightly sealed during transportation and warehouse storage. Store in cool, dry and low‑humidity warehouse environment to prevent moisture absorption. Avoid excessive stacking height on pallets to prevent bag rupture. Wear dust‑proof masks and protective gloves during powder‑handling operations.

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Hexagonal Boron Nitride Powder (h-BN) CAS 10043-11-5, Silane-Modified Thermally Conductive Electrical Insulating Filler

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.