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High Performance Expandable Microspheres CAS 38742-70-0 220℃+ Processing Temperature Polymer Filler

High Performance Expandable Microspheres CAS 38742-70-0 are premium lightweight polymer fillers adaptable to processing temperatures above 220℃. The microspheres maintain stable expansion under high-temperature production conditions and form fine closed-cell structures within polymer matrix. They achieve lightweight modification and lower raw material costs while retaining mechanical properties, thermal resistance and dimensional stability of plastic parts. With outstanding heat resistance, good

High Performance Expandable Microspheres CAS 38742-70-0 220℃+ Processing Temperature Polymer Filler

Product Overview

High Performance Expandable Microspheres CAS 38742-70-0 are premium lightweight polymer fillers designed for processing temperatures above 220℃. Optimized to adapt to high-temperature injection and extrusion processes of various polymers, these microspheres maintain intact particle structure and steady expansion performance under rigorous thermal conditions. Fine, dense and independent closed-cell structures are formed inside polymer matrix, effectively reducing product density and raw material consumption. While completing lightweight modification, the product preserves excellent mechanical properties, heat resistance and dimensional stability of molded parts. Featuring remarkable thermal stability, reliable shear resistance and broad compatibility with multiple resin systems, it is a versatile high-temperature foaming additive for engineering plastics.

Core Features

Stable Performance above 220℃ Processing Temperature
Specially customized thermal property adapts to polymer processing temperature over 220℃. Microspheres expand uniformly without premature foaming, particle rupture or cell collapse, meeting requirements of continuous automated manufacturing.
Strong Shear Resistance with Low Breakage Rate
Enhanced shell toughness withstands intense shear force during high-speed molding. Fewer broken particles reduce surface defects such as silver streaks and pits to satisfy appearance standards of precision plastic components.
Effective Lightweight & Cost Reduction
Uniform closed-cell structure delivers stable weight reduction effect. It cuts material usage and overall production costs without obvious loss of rigidity and heat resistance of polymer products.
Wide Compatibility with Polymers
Ultra-fine powder disperses evenly in numerous thermoplastics and modified materials without agglomeration. It will not adversely affect surface gloss, printing and bonding performance of finished plastics.
Improved Dimensional Accuracy
Balances internal stress generated during high-temperature molding, restrains shrinkage, warpage and deformation, and increases the yield of precision plastic products.
Eco-Friendly Physical Foaming System
Adopts pure physical thermal expansion principle, no chemical decomposition, low VOC and low odor. Suitable for automotive and electronic plastic parts with strict environmental requirements.

Product Specifications

Product Name: High Performance Expandable Microspheres
CAS No: 38742-70-0
Product Type: High Temperature Polymer Filler, Physical Foaming Agent
Applicable Processing Temperature: 220℃ and above
Appearance: White Ultra-Fine Powder
Applicable Processes: High-temperature injection molding, extrusion molding
Applicable Materials: Multiple engineering plastics and modified polymers
Core Function: Polymer lightweight modification, density reduction, raw material cost optimization
Recommended Dosage: 1.2%–4.0% (Adjust according to lightweight target and product performance requirements)

Application Scope

Suitable for lightweight foaming modification of polymers requiring processing temperature above 220℃. Widely used in automotive plastic components, electronic precision housings, industrial structural parts, modified plastic pellets and high-performance consumer plastic products. It solves the problems of heavy weight and high raw material consumption of solid plastic parts, covering automobile, electronics, new energy and industrial plastic processing industries.

Usage Guide

Mix high performance expandable microspheres with polymer raw materials evenly via low-speed stirring at room temperature. Avoid high-intensity shear stirring and long-time high-temperature preheating to prevent microsphere rupture and premature foaming. Carry out standard high-temperature injection or extrusion processes. Microspheres realize stable thermal expansion and closed-cell forming under matched processing temperature higher than 220℃. Adjust microsphere dosage, molding temperature, injection speed and holding pressure based on lightweight targets and surface quality requirements. Keep sealed and moisture-proof during production and storage.

Packaging & Storage

Packaging: 25kg sealed moisture-proof composite bag with inner PE liner, dust-proof and leak-proof, suitable for industrial bulk supply and long-distance transportation.
Storage: Store in dry, cool and ventilated warehouse, keep tightly sealed at all times. Avoid direct sunlight, high-temperature stacking and humid environment to prevent caking and spontaneous foaming. Standard shelf life is 12 months under proper storage conditions.

Our Advantages

Our high performance expandable microspheres support processing temperature over 220℃, with stable expansion ratio and excellent batch consistency. Delicate closed-cell structure achieves efficient lightweight and cost control while ensuring mechanical properties and surface quality of polymer products. We provide factory direct sales, stable bulk supply, free sample testing and professional foaming formula technical support to help customers enhance product competitiveness.


High Performance Expandable Microspheres CAS 38742-70-0 220℃+ Processing Temperature Polymer Filler
High Performance Expandable Microspheres CAS 38742-70-0 are premium lightweight polymer fillers adaptable to processing temperatures above 220℃. The microspheres maintain stable expansion under high-temperature production conditions and form fine closed-cell structures within polymer matrix. They achieve lightweight modification and lower raw material costs while retaining mechanical properties, thermal resistance and dimensional stability of plastic parts. With outstanding heat resistance, good
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High Performance Expandable Microspheres CAS 38742-70-0 220℃+ Processing Temperature Polymer Filler

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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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