JSYAPG‑DIA water‑based diamond lapping slurry uses graded micron‑sized synthetic diamond powder as core abrasive. It is compounded with specialized wetting agents, high‑efficiency dispersants, anti‑settling stabilizers and water‑based lubricants. This product is available in multiple particle‑size grades to match different rough lapping, fine lapping and pre‑polishing procedures. It is developed for processing high‑hardness substrates including technical ceramic, sapphire wafer and cemented hard

Product Detail

Product Detail Page: JSYAPG‑DIA water‑based diamond lapping slurry adopts strictly classified synthetic micron diamond grit. Raw diamond powder goes through shape screening, impurity removal and multi‑stage particle sorting before slurry compounding. During production, high‑shear dispersion is applied to break soft agglomerates, followed by fine filtration to eliminate oversized diamond particles. Formulated suspension stabilizers slow down rapid sedimentation of high‑density diamond grains inside aqueous carrier. Lubricating additives reduce instantaneous frictional heat at the contact zone between lapping plate and hard workpiece, lowering thermal‑stress risk during high‑speed lapping cycles.

Ceramic, sapphire and cemented hard alloy belong to extremely hard workpiece materials. Conventional oxide‑based abrasive slurries suffer from low removal rates, long processing cycles and poor production efficiency. Diamond possesses superior Mohs hardness, which enables fast stock removal on these tough substrates. However, improperly controlled large diamond particles or hard agglomerates can produce deep scratches and severe subsurface micro‑cracks. These hidden internal defects will act as fracture initiation points when finished components endure mechanical loading, leading to premature failure of cutting tools, mould inserts and optoelectronic substrates.

With multi‑grit selection capability, this water‑based diamond lapping slurry can cover different manufacturing stages: coarser grit for rapid stock removal in rough lapping, medium grit for material leveling, and finer micron grades for fine lapping before final CMP. The water‑based carrier offers excellent cooling performance during lapping operations, which suppresses local over‑heating of hard‑brittle crystal substrates. It is compatible with double‑sided lapping machines, flat lapping platforms and rotary grinding equipment for batch production.

Process technicians can dilute the concentrated base slurry with deionized water to adjust working abrasive concentration. Lapping results can be optimized by tuning down‑force, lapping plate rotation speed and slurry circulation feed rate. Proper filtration of recirculated slurry is strongly recommended to prevent accumulated abrasive debris from scratching workpieces during continuous mass‑production.

Foreign chemical contamination, prolonged high‑temperature storage and freezing must be strictly avoided. Freezing will damage the dispersion system and trigger irreversible sedimentation of dense diamond particles. If settled diamond cannot be fully re‑homogenized after vigorous stirring, the slurry shall not be used for precision lapping.

Major application fields include rough and fine lapping for sapphire optoelectronic substrates, precision grinding of cemented hard‑alloy cutting tools and mould components, material removal processing for dense advanced structural ceramic parts.

Store the product in tightly‑sealed original plastic drums within 5‑30℃. Prevent direct sunlight and freezing environments. Thorough mechanical stirring is mandatory before utilizing long‑term stored batches.

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(JSYAPG-DIA) Diamond Lapping Slurry Water-Based CAS 7782-40-3, Multi-Grit Micron Diamond for Ceramic, Sapphire & Hard Alloy

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.