JSYAPG‑GLANZOX colloidal silica final polish slurry is a high‑end final‑stage polishing slurry for semiconductor silicon‑based substrates. Spherical ultra‑high‑purity colloidal silica nanoparticles act as core abrasive, compounded with specialized pH regulators and wetting additives. This product is dedicated to the final polishing of bare silicon wafers and epitaxial wafers. It removes micro‑scratches, subsurface residual damage and surface haze, delivering ultra‑smooth wafer surface with minim

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Product Detail Page: JSYAPG‑GLANZOX final polish slurry adopts spherical ultra‑high‑purity colloidal silica nanoparticles uniformly dispersed in ultra‑pure aqueous medium. Multi‑stage fine filtration is implemented during manufacturing to eliminate oversized coarse particles. Rigorous ion‑removal purification treatment lowers metallic and ionic impurities to extremely low levels, fulfilling strict material requirements for prime‑grade silicon and epitaxial wafers. Optimized electrostatic stabilization suppresses nanoparticle agglomeration and sedimentation during storage and transportation, ensuring consistent polishing quality among different production batches.

Silicon wafer final polishing is the critical finishing procedure before wafer shipment. Residual micro‑damage, grinding traces and surface haze generated during previous lapping and rough polishing must be eliminated. This slurry performs mild chemical‑mechanical removal on silicon surfaces. The spherical abrasive morphology avoids deep mechanical scratching. Controlled chemical etching action removes subsurface damaged silicon lattice, effectively reducing surface haze value.

For epitaxial wafers, the surface condition of the base substrate directly affects the quality of subsequent epitaxial thin‑film growth. Even minor surface defects, residual particles or micro‑haze may induce epitaxial defects, stacking faults and crystal dislocations in the deposited epitaxial layer. By delivering ultra‑smooth, low‑defect surface finishing, this slurry creates an ideal substrate surface for epitaxy deposition. It helps to improve the yield of subsequent chip fabrication.

Wet‑modulating additives inside the slurry improve the wetting property between polishing pad and wafer surface. It reduces local dry friction spots during polishing and further lowers the risk of thermal‑induced surface defects.

Process engineers are allowed to dilute the concentrated stock slurry with ultra‑pure deionized water to adjust effective abrasive concentration. The working slurry can be tuned according to polishing equipment, polishing pressure and platen speed to match mass‑production final‑polish recipes for silicon substrates.

Strong‑acid or strong‑alkali contamination, prolonged high‑temperature storage and freezing must be strictly avoided. Harsh environmental conditions will destroy colloidal stability of silica nanoparticles, triggering irreversible flocculation, sedimentation and gelation. Deteriorated slurry cannot be used for wafer finishing.

Major application fields include final polishing of bare silicon wafer, surface finishing for silicon epitaxial wafer, low‑defect substrate preparation for semiconductor chip manufacturing.

Store the product in tightly‑sealed original plastic containers within 5‑30℃. Prevent direct sunlight and freezing environments. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term inventory to slow down bottom sediment accumulation.

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(JSYAPG-GLANZOX) Colloidal Silica Final Polish Slurry Ultra-High-Purity for Silicon Wafer & Epitaxial Wafer, Low Defect

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.