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OH Polymer 107 5000 cst CAS 70131‑67‑8 | Silicone Polymer for Electronic Potting Compound

OH Polymer 107 with viscosity 5000 cst is hydroxyl‑terminated polydimethylsiloxane. It serves as core base polymer for two‑component room‑temperature vulcanized silicone rubber. Featuring moderate viscosity, reliable hydroxyl reactivity, outstanding electrical insulation performance, low temperature resistance and anti‑aging property. Widely used for manufacturing electronic potting compound, sealing adhesive and general RTV silicone sealant.

Product Overview

OH Polymer 107 5000 cst CAS 70131‑67‑8 is hydroxyl‑terminated polydimethylsiloxane base polymer. This linear silicone polymer contains reactive hydroxyl end groups, which can cross‑link with cross‑linker under catalyst at room temperature to form elastic silicone rubber. Constant 5000 cst viscosity brings good processability for compounding. The cured material provides superior dielectric property, moisture proof, shock resistance and long‑term weather stability, perfectly suitable for electronic potting system.

Key Features

  1. Stable 5000 cst viscosity, easy mixing and compounding processing
  2. Reactive hydroxyl end groups, good cross‑linking reactivity with silane cross‑linkers
  3. Excellent electrical insulation performance for electronic protection
  4. Outstanding low‑temperature flexibility, anti‑aging and weather resistance
  5. Low volatility, good compatibility with silicone fillers and additives

Main Applications

  • Base polymer for electronic potting compound
  • Two‑component RTV silicone rubber formulation
  • Electronic module sealing and encapsulation raw material
  • Industrial silicone sealant and adhesive production
  • Insulation potting for circuit board and electrical components

Usage Recommendation

Mix with cross‑linker, filler and catalyst according to formulation ratio under dry condition. Avoid moisture contamination during whole compounding process, as moisture will affect cross‑linking reaction. Adjust filler loading to modify hardness, viscosity and mechanical performance of finished potting compound.

Storage & Package

Store in cool, dry and air‑tight warehouse. Strictly isolate from water, moisture and humid air to prevent premature cross‑linking. Standard package in iron drum. Keep drum fully sealed after partial discharge. Operate under dry environment when opening containers.


OH Polymer 107 5000 cst CAS 70131‑67‑8 | Silicone Polymer for Electronic Potting Compound
OH Polymer 107 with viscosity 5000 cst is hydroxyl‑terminated polydimethylsiloxane. It serves as core base polymer for two‑component room‑temperature vulcanized silicone rubber. Featuring moderate viscosity, reliable hydroxyl reactivity, outstanding electrical insulation performance, low temperature resistance and anti‑aging property. Widely used for manufacturing electronic potting compound, sealing adhesive and general RTV silicone sealant.
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OH Polymer 107 5000 cst CAS 70131‑67‑8 | Silicone Polymer for Electronic Potting Compound

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  Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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