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Multi-Modal Spherical Fused Silica Powder Blend CAS 7631-86-9, Ternary Particle Size Distribution for Maximum Packing & Low-Expansion EMC

Multi-Modal Spherical Fused Silica Powder Blend CAS 7631-86-9, Ternary Particle Size Distribution for Maximum Packing & Low-Expansion EMC

Multi‑Modal Spherical Fused Silica Powder Blend CAS 7631‑86‑9 is a homogeneous physical mixture of three distinct spherical fused silica particle fractions (coarse, medium, fine). Each individual fraction is manufactured via flame spheroidization, classification and purification before precise proportion blending. The ternary particle‑size grading achieves maximum packing density. It is specially developed for epoxy molding compound (EMC). The blended filler permits ultra‑high filler loading, lo
Spherical Fused Silica Powder for Precision Casting CAS 7631-86-9, High-Temp Investment Casting Shell & Refractory

Spherical Fused Silica Powder for Precision Casting CAS 7631-86-9, High-Temp Investment Casting Shell & Refractory

Spherical Fused Silica Powder for Precision Casting CAS 7631‑86‑9 is amorphous fused silica manufactured from high‑grade quartz through high‑temperature flame spheroidization, crushing removal of angular fragments and particle‑size classification. Spherical particle morphology optimizes refractory slurry rheology. It serves as key refractory raw material for investment casting shell making and related refractory products, enhancing thermal‑shock resistance of ceramic shell and minimizing shell c
Spherical Fused Silica Powder for Silicone Rubber CAS 7631-86-9, Reinforcing Filler for HTV LSR Thermal Conductive & Insulating

Spherical Fused Silica Powder for Silicone Rubber CAS 7631-86-9, Reinforcing Filler for HTV LSR Thermal Conductive & Insulating

Spherical Fused Silica Powder for Silicone Rubber CAS 7631‑86‑9 is amorphous fused silica produced via high‑temperature flame spheroidization, classification and purification. Smooth spherical particles reduce compound viscosity during kneading. It acts as functional reinforcing filler for HTV high‑temperature vulcanized silicone rubber and LSR liquid silicone rubber. The filler enhances dimensional stability, provides reliable electrical insulation and assists moderate thermal dissipation for s
Spherical Fused Silica Powder for Coatings CAS 7631-86-9, Scratch-Resistant Wear-Resistant for Wood Industrial & Anti-Corrosion Paint

Spherical Fused Silica Powder for Coatings CAS 7631-86-9, Scratch-Resistant Wear-Resistant for Wood Industrial & Anti-Corrosion Paint

Spherical Fused Silica Powder for Coatings CAS 7631‑86‑9 is amorphous fused silica produced by high‑temperature flame spheroidization of quartz, followed by classification and particle‑size adjustment. Uniform spherical particles provide moderate hardness without sharp abrasive cutting effect. It is incorporated into coating systems to increase surface scratch resistance and wear resistance of paint film. The filler is widely used for wood paint, industrial topcoats and metal anti‑corrosion coat
Low-Dielectric Spherical Fused Silica Powder CAS 7631-86-9, Low-Dk Low-Df for 5G High-Frequency High-Speed CCL & Antenna

Low-Dielectric Spherical Fused Silica Powder CAS 7631-86-9, Low-Dk Low-Df for 5G High-Frequency High-Speed CCL & Antenna

Low‑Dielectric Spherical Fused Silica Powder CAS 7631‑86‑9 is produced from high‑purity low‑impurity quartz through high‑temperature flame spheroidization, multi‑stage purification and precise classification. It features inherent low‑Dk and low‑Df properties across high‑frequency ranges. Smooth spherical particle morphology delivers favorable resin fluidity. The filler is used for 5G high‑speed copper‑clad laminate and antenna substrate materials, reducing thermal expansion of substrate sheets a
High-Sphericity Fused Silica Powder CAS 7631-86-9, Roundness ≥95% High-Flow for EMC CPO & Low-Viscosity Resin

High-Sphericity Fused Silica Powder CAS 7631-86-9, Roundness ≥95% High-Flow for EMC CPO & Low-Viscosity Resin

High‑Sphericity Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced under optimized high‑temperature flame spheroidization process, followed by shape screening and air classification. Particle roundness is controlled ≥95%. The well‑rounded particle geometry lowers friction between particles, providing outstanding powder flow and helping maintain low viscosity at high filler loading. It is applied for EMC semiconductor encapsulation, CPO co‑packaged optics modules and low‑viscosi
Silane-Modified Spherical Fused Silica Powder CAS 7631-86-9, Hydrophobic Surface-Treated for Resin Compatibility & High-Filling

Silane-Modified Spherical Fused Silica Powder CAS 7631-86-9, Hydrophobic Surface-Treated for Resin Compatibility & High-Filling

Silane‑Modified Spherical Fused Silica Powder CAS 7631‑86‑9 is produced by flame spheroidized spherical fused silica with dedicated silane coupling agent surface modification treatment. The hydrophilic hydroxyl groups on particle surface are chemically converted into hydrophobic organic layers. It significantly enhances interfacial compatibility between inorganic silica and thermoset resin. The modified powder is suitable for high‑loading formulations of epoxy molding compound, potting resin and
Large-Particle Spherical Fused Silica Powder CAS 7631-86-9, >40μm for Casting Resin Potting Compound & High-Loading Filler

Large-Particle Spherical Fused Silica Powder CAS 7631-86-9, >40μm for Casting Resin Potting Compound & High-Loading Filler

Large‑Particle Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced by high‑temperature flame spheroidization of high‑grade quartz, followed by screening and air classification. The particle size is controlled above 40μm. Thanks to low specific surface area, the large spherical particles require less resin for surface wetting. It is used as high‑loading mineral filler for thick‑section casting resin and electrical potting compound, cutting resin dosage, moderating curin
Micron Spherical Fused Silica Powder CAS 7631-86-9, 1–5μm for EMC Encapsulation CPO & General Electronic Filler

Micron Spherical Fused Silica Powder CAS 7631-86-9, 1–5μm for EMC Encapsulation CPO & General Electronic Filler

Micron Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced from high‑purity quartz via high‑temperature flame fusion, spheroidization and precision air‑jet classification. The particle‑size range is tightly controlled within 1‑5μm. Smooth spherical particles offer good powder flow and favorable resin dispersion performance. It serves as a key mineral filler for epoxy molding compound, CPO co‑packaged optics encapsulation and a broad range of general‑electronic resin fo
Submicron Spherical Fused Silica Powder CAS 7631-86-9, 0.5–1μm High-Dispersion for High-Loading Resin & Optical Adhesive

Submicron Spherical Fused Silica Powder CAS 7631-86-9, 0.5–1μm High-Dispersion for High-Loading Resin & Optical Adhesive

Submicron Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica produced by high‑temperature flame spheroidization, wet classification and dispersion‑optimized purification. Particle‑size range is strictly controlled at 0.5‑1μm. Uniform spherical geometry and minimized hard agglomeration provide superior dispersibility within liquid resin. It is applied in high‑loading thermoset resin and optical adhesive formulations to lower curing shrinkage, adjust thermal expansion and mainta
Nano Spherical Fused Silica Powder CAS 7631-86-9, Sub-Micron <1μm for Underfill Flip-Chip & High-Frequency CCL

Nano Spherical Fused Silica Powder CAS 7631-86-9, Sub-Micron <1μm for Underfill Flip-Chip & High-Frequency CCL

Nano Spherical Fused Silica Powder CAS 7631‑86‑9 is amorphous fused silica manufactured via high‑temperature spheroidization, wet‑mode classification and fine purification. The particle size is controlled below 1μm at sub‑micron‑nano range. Uniform spherical morphology brings outstanding dispersibility, low thermal expansion and stable dielectric performance. It serves as key mineral filler for flip‑chip underfill resin and high‑frequency copper‑clad laminate (CCL), minimizing resin shrinkage an
Low-Alpha Spherical Fused Silica Powder CAS 7631-86-9, Ultra-Low Radioactivity for Advanced IC CPO Encapsulation & HBM

Low-Alpha Spherical Fused Silica Powder CAS 7631-86-9, Ultra-Low Radioactivity for Advanced IC CPO Encapsulation & HBM

Low‑Alpha Spherical Fused Silica Powder CAS 7631‑86‑9 is manufactured from carefully selected low‑radioactivity quartz ore through high‑temperature fusion, flame atomization, multi‑stage classification and dedicated radioactive‑element removal purification. Alpha‑particle emission rate is controlled at an extremely low level. With spherical amorphous particle morphology, low thermal expansion and high electrical insulation, this filler is developed for high‑end advanced semiconductor packaging i

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