Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4.9μm for CPO Thermal Management & High‑Conductive Plastic
Spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 4.9μm. Manufactured by high‑temperature spheronization and multi‑stage air classification to obtain round, stable alpha‑phase alumina particles. This thermally conductive inorganic filler builds continuous thermal conduction networks inside polymer matrix. It is used for CPO semiconductor thermal‑management materials and high‑conductive engineering plastic to improve heat dissipation, dimensional stability and melt flow during plastic processing.
Product Detail PageSpherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4.9μm for CPO Thermal Management & High‑Conductive PlasticThis spherical α‑alumina filler is produced through high‑temperature melting, spheronization treatment followed by precise multi‑step air classification. The material retains a stable alpha‑alumina crystal structure, with D50 particle size tightly controlled at 4.9 μm. Rigorous particle screening removes over‑sized coarse particles, which effectively reduces abrasive wear to twin‑screw extruder barrels, screws and injection molding molds during compounding and plastic manufacturing.
Its smooth rounded particle morphology reduces inter‑particle friction when dispersed in molten thermoplastic or liquid thermoset resin. Unlike angular crushed alumina powder, this spherical alumina permits higher filler loading without causing excessive viscosity surge. Higher loading facilitates the formation of interconnected thermal conduction pathways within the polymer composite, significantly boosting overall bulk thermal conductivity of finished plastic components.
For CPO semiconductor thermal‑management systems, this alumina filler is incorporated into thermally conductive encapsulation resins and structural plastic components for high‑power chip packages. It helps dissipate concentrated hot‑spot heat generated during chip operation, moderates thermal cycling‑derived mechanical stress inside CPO packaging modules, and reduces the risk of package warpage or internal cracking. Trace alkali‑metal impurities are strictly controlled to limit ion migration risk under high‑temperature and humid operating conditions, safeguarding long‑term electrical reliability of advanced semiconductor packages.
The filler demonstrates good inherent compatibility with a broad range of thermoplastic resins as well as epoxy‑based thermosetting resins. Custom silane surface modification service is available to improve interfacial affinity between alumina particle surfaces and polymer matrices. Surface treatment lowers interfacial thermal resistance, enhances composite tensile and flexural strength, and improves moisture‑resistance performance of final products.
It can be physically blended with finer or coarser spherical alumina grades to create graded particle‑size distribution. Optimized particle grading achieves maximum feasible filler loading to meet higher thermal‑conductivity targets for custom CPO formulations and thermally‑conductive plastic compounds.
Sealed dry storage is required for this powder to prevent moisture absorption prior to batching and compounding. Cross‑contamination with crushed angular alumina grades should be strictly avoided during powder weighing, pneumatic conveying and feeding procedures. This D50 4.9 μm spherical α‑alumina filler serves as a premium thermally conductive inorganic filler for CPO semiconductor thermal management and high‑performance high‑conductive engineering plastic applications.
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