Spherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 46μm Large‑Particle for CPO Potting & TIM High‑Loading
Large‑particle spherical α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 46 μm. Produced by high‑temperature spheronization and precise classification, featuring stable alpha‑alumina crystal phase and smooth round particle shape. This thermally conductive inorganic filler is dedicated to CPO potting resin and high‑loading TIM formulations. Large spherical particles help to realize ultra‑high filling degree inside polymer matrix, constructing continuous heat‑transfer networks and significantly enhancing overa
Product Detail PageSpherical Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 46μm Large‑Particle for CPO Potting & TIM High‑LoadingThis large‑particle spherical α‑alumina filler is manufactured through high‑temperature fusion, spheronization and multi‑stage screening classification. It maintains a stable alpha‑alumina crystalline structure with excellent intrinsic thermal conductivity, outstanding thermal stability and chemical inertness. The median particle size D50 is tightly controlled at 46 μm. Oversized agglomerates are strictly removed during classification to minimize severe abrasion of mixing equipment, although higher hardness of large alumina particles still requires wear‑resistant processing hardware during compounding.
The smooth spherical contour reduces particle‑to‑particle friction within liquid resin. Compared with coarse irregular crushed alumina, this spherical large‑size grade permits much higher filler loading before resin viscosity rises sharply. Large particles create direct thermal‑contact points inside the polymer matrix, which is critical for establishing efficient continuous thermal conduction networks. Higher filling fraction substantially increases bulk thermal conductivity of cured potting and thermal‑interface composites.
For CPO potting applications, this filler is incorporated into thick‑layer potting encapsulant for high‑power semiconductor modules. It quickly dissipates accumulated working heat from packaged chips, moderates thermal‑mechanical stress caused by frequent temperature fluctuation, and reduces the risks of internal crack and delamination of thick potting layers. Trace alkali‑metal and ionic impurities are strictly controlled to prevent electrochemical migration under high‑temperature‑humidity service conditions, securing long‑term insulation reliability for CPO power packages.
In high‑loading TIM thermal‑interface‑material systems, the 46 μm large spherical alumina is commonly blended together with finer alumina fractions to form optimized graded particle‑size distribution. Graded filling maximizes solid content within silicone or epoxy‑based TIM, greatly boosting thermal‑dissipation capability for thermal gap fillers and thermal potting compounds.
Custom silane surface modification is available to improve interfacial wetting and bonding between large alumina particles and polymer resin. Proper surface treatment reduces interfacial thermal resistance and enhances the mechanical strength and moisture resistance of cured composites. This large‑particle alumina cannot be used for fine‑gap dispensing processes due to its big particle dimension, and it is only suitable for thick‑layer potting and gap filling scenarios.
The powder needs sealed dry storage to avoid moisture absorption prior to compounding. During weighing, conveying and feeding operations, cross‑contamination with fine alumina or crushed angular alumina grades should be avoided to preserve targeted particle‑size grading results. This D50 46 μm large‑particle spherical α‑alumina filler serves as a key high‑loading thermally conductive inorganic filler for CPO potting compounds and high‑performance TIM thermal interface materials.
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