Spherical Fused Silica Powder 2.5μm CAS 60676-86-0 Semiconductor EMC Advanced Packaging Filler (Admatechs SO-25R Equivalent)
Spherical Fused Silica Powder 2.5μm is high‑purity spherical fused silica serving as direct replacement for Admatechs SO‑25R. With smooth spherical particle morphology, this filler improves flowability of epoxy molding compound. It lowers coefficient of thermal expansion, mitigates internal stress, enhances thermal stability and mechanical performance for semiconductor EMC applied in advanced chip packaging.
Product Overview Spherical Fused Silica Powder 2.5μm (CAS 60676‑86‑0, Admatechs SO‑25R Equivalent) is high‑purity amorphous fused silica with controlled spherical particle shape and median particle size of 2.5 μm. Smooth spherical geometry effectively reduces viscosity of molten epoxy molding compound during encapsulation. Homogeneous dispersion inside epoxy matrix decreases overall thermal expansion coefficient, alleviates thermal‑induced internal stress of packaged chips, and minimizes warpage risk for semiconductor components. Low radioactive impurity level satisfies strict reliability requirements for microchip encapsulation. This spherical fused silica is dedicated filler for semiconductor EMC and advanced chip packaging formulations.
Key Features ‑ Smooth spherical particle shape improves flow behaviour of epoxy molding compound ‑ Low coefficient of thermal expansion reduces package warpage and internal stress ‑ High purity with low radioactive impurity for semiconductor reliability requirements ‑ Good thermal stability under high‑temperature epoxy curing conditions ‑ Direct functional equivalent grade for Admatechs SO‑25R spherical fused silica powder
Typical Technical Properties ‑ Chemical Type: High‑purity amorphous spherical fused silica ‑ Appearance: White free‑flowing fine powder ‑ Median Particle Size: 2.5 μm ‑ Bulk Density: Refer to TDS ‑ Alpha‑ray Count: Refer to TDS
Applications ‑ Semiconductor EMC manufacturing: Functional filler for epoxy molding compound ‑ Advanced chip packaging: Low‑stress mineral filler for fine‑pitch semiconductor encapsulation ‑ Electronic epoxy compounding: High‑purity spherical silica for electronic encapsulant ‑ Electronic material plant: Raw filler for high‑reliability semiconductor packaging materials
Processing Recommendation Add spherical fused silica powder during premixing stage of epoxy molding compound production. Optimize feeding proportion to balance melt viscosity and thermal‑mechanical performance. Ensure homogeneous mixing. Complete compounding and encapsulation lab trials before mass production of EMC materials.
Storage & Handling Store in cool, dry, dust‑free warehouse, strictly avoid heavy metal contamination. Reseal packaging after opening. Wear dust‑proof mask and protective gloves when handling fine silica powder.
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Spherical Fused Silica Powder 2.5μm CAS 60676-86-0 Semiconductor EMC Advanced Packaging Filler (Admatechs SO-25R Equivalent)
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