Spherical Fused Silica Powder 5μm CAS 60676-86-0 Epoxy Molding Compound Semiconductor Filler (Admatechs SO-50R Equivalent)
Spherical Fused Silica Powder 5μm is high‑purity amorphous spherical fused silica as direct replacement for Admatechs SO‑50R. Its smooth spherical particle morphology enhances flow properties of epoxy molding compound. This filler reduces thermal expansion coefficient and internal residual stress, improves rigidity of cured epoxy system, and meets high reliability requirements for general semiconductor chip encapsulation.
Product Overview Spherical Fused Silica Powder 5μm (CAS 60676‑86‑0, Admatechs SO‑50R Equivalent) is high‑purity amorphous fused silica powder with median particle size controlled at 5 μm. The smooth spherical particle structure effectively lowers melt viscosity of epoxy molding compound during moulding procedure. When homogeneously dispersed within epoxy resin matrix, the silica filler lowers overall coefficient of thermal expansion, reduces residual internal stress and restricts package warpage for semiconductor components. Strictly controlled low‑alpha‑ray impurity level minimizes soft‑error risk for microelectronic devices. This spherical fused silica is an essential functional filler for semiconductor‑grade epoxy molding compound.
Key Features ‑ Smooth spherical particle shape improves melt flowability of epoxy molding compound ‑ Low thermal expansion coefficient reduces residual stress and package warpage ‑ High purity with controlled low alpha‑ray content for semiconductor reliability ‑ Excellent thermal stability under high‑temperature epoxy curing conditions ‑ Direct functional equivalent grade for Admatechs SO‑50R spherical fused silica powder
Typical Technical Properties ‑ Chemical Type: High‑purity amorphous spherical fused silica ‑ Appearance: White free‑flowing fine powder ‑ Median Particle Size: 5 μm ‑ Bulk Density: Refer to TDS ‑ Alpha‑ray Count: Refer to TDS
Applications ‑ Semiconductor EMC production: Reinforcing filler for general‑grade epoxy molding compound ‑ Chip encapsulation: Low‑stress mineral filler for discrete device and IC packaging ‑ Electronic epoxy compounding: High‑purity spherical silica for electronic encapsulant ‑ Electronic raw‑material plant: Raw filler for semiconductor packaging thermoset materials
Processing Recommendation Add spherical fused silica powder during premixing stage of epoxy molding compound manufacturing. Adjust filler loading to balance melt viscosity and thermo‑mechanical performance. Ensure sufficient homogeneous mixing. Conduct encapsulation lab trials before large‑scale EMC production.
Storage & Handling Store in cool, dry, dust‑free warehouse, avoid heavy‑metal contamination. Reseal packaging after opening. Wear dust‑proof mask and protective gloves when handling fine silica powder.
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