0.7 μm submicron spherical silica filler, CAS 7631‑86‑9, features outstanding dispersion property. Uniform submicron spherical particles minimize slurry thickening effect at high filling fractions. This inorganic filler is formulated for CPO underfill encapsulant and high‑loading resin, lowering thermal expansion coefficient and enhancing mechanical stability for advanced microelectronic packaging structures.

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Product Detail PageSubmicron Spherical Silica Filler 0.7μm CAS 7631‑86‑9, High‑Dispersion for CPO Underfill & High‑Loading ResinThis submicron spherical silica filler has a nominal particle size of 0.7 μm and amorphous silica structure manufactured by high‑temperature fusion and precise classification. Strict particle‑size control eliminates coarse oversized grains which may block tiny capillary gaps inside CPO chip packages during underfill dispensing.

High‑dispersion characteristic prevents severe particle agglomeration within liquid resin matrix. Even at relatively high filler loading, the composite slurry retains suitable fluidity to flow into narrow gaps between chip and substrate during underfill processing. Homogeneous particle distribution after curing reduces local stress concentration inside the underfill layer.

The filler reduces overall coefficient of thermal expansion of cured underfill resin. It alleviates thermally induced shear stress generated at the solder bump interconnects under temperature cycling, which significantly improves long‑term reliability of CPO packaging modules. Low ionic and heavy‑metal impurity levels guarantee stable electrical insulation performance for fine‑pitch chip interconnection systems.

It exhibits favorable compatibility with epoxy‑based underfill resins and other thermosetting high‑loading resin formulations. Surface modification can be implemented to further enhance interfacial bonding strength between silica particles and resin matrix when required by specific formulas.

Strict filtration and classification processes remove coarse contaminants. The powder must be sealed and stored under low‑humidity conditions to avoid moisture‑triggered agglomeration. Cross‑contamination with other coarse mineral fillers should be avoided during powder transfer, weighing and batching operations. This 0.7 μm high‑dispersion submicron spherical silica filler serves as a critical functional inorganic filler material for CPO underfill and high‑loading advanced electronic resin systems.

Previous : Spherical Fused Silica Filler Flame-Fused CAS 7631-86-9, D50 5–40μm for EMC CPO Low-Expansion Encapsulation Next : Nano Spherical Silica Filler 0.3μm/100nm CAS 7631-86-9, for CPO Underfill High-Frequency CCL & Nanocomposite

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Submicron Spherical Silica Filler 0.7μm CAS 7631-86-9, High-Dispersion for CPO Underfill & High-Loading Resin

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.