Ultra High Temperature Expandable Microspheres CAS 38742-70-0 withstand 220–260℃ processing temperature, serving as dedicated physical foaming agents for PC, PA and other high-temperature engineering plastics. The microspheres maintain stable expansion under ultra-high temperature molding conditions and form fine closed-cell structure inside polymer matrix. They realize effective lightweighting and reduce raw material costs while preserving the high rigidity, heat resistance and dimensional stab

Product Detail

Ultra High Temperature Expandable Microspheres CAS 38742-70-0 PC PA Engineering Plastic Foaming Agent 220-260℃

Product Overview

220-260℃ Ultra High Temperature Expandable Microspheres CAS 38742-70-0 are high-performance physical foaming and lightweight fillers specially developed for high-temperature engineering plastics. Professionally optimized to adapt to the ultra-high temperature molding characteristics of PC, PA and other high-rigidity engineering plastics, these microspheres maintain complete particle structure and stable expansion performance under 220–260℃ extreme processing conditions. They form uniform, dense and independent fine closed-cell structures inside engineering plastic substrates, effectively reducing product density and cutting raw material consumption. While realizing efficient lightweight modification, the product perfectly retains the original high rigidity, excellent heat resistance, tensile strength and ultra-high dimensional stability of PC and PA components. With outstanding thermal stability, strong shear resistance and perfect compatibility with various engineering plastic systems, it is a premium dedicated foaming agent for high-precision engineering plastic products.

Core Features

220-260℃ Ultra-High Temperature Resistance: Customized ultra-high temperature resistant formula perfectly matches the high-temperature molding process of PC, PA and other engineering plastics. No premature foaming, particle rupture or cell collapse under extreme processing temperature, ensuring stable and controllable industrial production.

Strong High-Shear Resistance: Reinforced microsphere shell structure resists intense shear force during high-speed injection and extrusion of engineering plastics. Extremely low breakage rate, effectively avoiding product surface defects and ensuring consistent foaming effect of each batch of precision parts.

High-Efficiency Lightweight & Cost Reduction: Delicate and uniform closed-cell structure achieves high lightweight efficiency. It greatly reduces the weight and material dosage of engineering plastic parts, effectively lowering overall production costs without sacrificing product structural rigidity and performance.

Excellent Compatibility with PC & PA: Ultra-fine powder features excellent dispersion and fusion with PC, PA and modified engineering plastics. No agglomeration, no bubble spots or surface streaks, and will not damage the original mechanical properties, surface gloss and secondary processing performance of materials.

Superior Dimensional Stability: Effectively balances the internal stress of engineering plastics during ultra-high temperature molding, inhibits shrinkage, warping and deformation of precision plastic parts, and significantly improves product yield and dimensional accuracy.

Safe & Eco-Friendly Physical Foaming: Adopts pure physical thermal expansion principle, no chemical decomposition, low odor and low VOC. It meets high-standard environmental protection requirements for electronic components, automotive engineering parts and high-end industrial plastic products.

Product Specifications

Product Name: 220-260℃ Ultra High Temperature Expandable Microspheres

CAS No: 38742-70-0

Product Type: Engineering Plastic Foaming Agent, High Temperature Lightweight Functional Filler

Foaming Temperature Range: 220℃–260℃

Appearance: White Ultra-Fine Powder

Applicable Materials: PC, PA, and other high-temperature resistant engineering plastics & modified materials

Applicable Processes: High-temperature injection molding, extrusion molding of precision engineering plastics

Core Function: Engineering plastic foaming, high-temperature lightweight modification, density reduction, cost saving, precision parts appearance optimization

Recommended Dosage: 1.5%–4.0% (Adjustable according to lightweight demand and product precision requirements)

Application Scope

Specially used for lightweight foaming modification of high-temperature resistant engineering plastics. Widely applicable to PC and PA precision plastic parts, automotive high-temperature resistant structural components, electronic equipment plastic housings, industrial engineering plastic accessories, high-rigidity modified plastic particles and other high-end plastic products. It solves the problems of heavy weight, high material consumption and easy deformation of traditional solid engineering plastic parts, and is widely used in automobile, electronics, industrial manufacturing and other high-precision fields.

Usage Guide

Mix ultra-high temperature expandable microspheres with PC/PA engineering plastic raw materials evenly through low-speed room-temperature stirring. Avoid high-strength shear stirring and long-term preheating to prevent microsphere damage and premature foaming. Conduct standard high-temperature injection and extrusion processes. The microspheres complete stable thermal expansion and precise closed-cell forming under 220–260℃ processing environment. Adjust microsphere dosage, molding temperature, injection speed and pressure parameters appropriately according to product lightweight standard and surface quality requirements. Keep sealed and moisture-proof throughout production and storage.

Packaging & Storage

Packaging: 25kg sealed moisture-proof composite bag with inner PE liner, dust-proof and leak-proof, suitable for industrial bulk supply and long-distance transportation.

Storage: Store in a dry, cool and ventilated warehouse, keep tightly sealed at all times. Avoid direct sunlight, high-temperature stacking and humid environment to prevent caking and spontaneous foaming. Standard shelf life is 12 months under proper storage conditions.

Our Advantages

Our 220-260℃ ultra-high temperature expandable microspheres are professionally customized for PC and PA high-temperature engineering plastic processing. Featuring ultra-high temperature resistance, strong shear resistance, stable expansion ratio and excellent batch consistency, the product can form uniform and delicate closed-cell structures. It achieves efficient lightweight and cost reduction while fully retaining the high rigidity and precision of engineering plastic parts. We support factory direct sales, stable bulk supply, free sample testing and professional engineering plastic foaming formula technical services to help customers produce high-quality lightweight precision plastic products.

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.