DE Grade Expanded Microspheres CAS 38742-70-0 are pre-expanded hollow microspheres used as lightweight filler for putty and joint compound. With stable closed-cell structure, they disperse uniformly in putty systems. The microspheres effectively lower bulk density, reduce raw material consumption and alleviate curing shrinkage. Meanwhile, they enhance thermal insulation performance of finished putty. The product features good compatibility with common putty raw materials, maintains excellent scr

Product Detail

DE Grade Expanded Microspheres CAS 38742-70-0 Lightweight Putty Joint Compound Filler

Product Overview

DE Grade Expanded Microspheres CAS 38742-70-0 are pre-expanded hollow polymer microspheres developed as lightweight functional filler for wall putty and gypsum board joint compound. With intact closed-cell structure and uniform particle size distribution, the microspheres can be evenly dispersed in water-based and dry-mix putty systems.

It effectively reduces bulk density of putty and joint compound, cuts raw material costs and relieves curing shrinkage to lower cracking risk. Besides lightweight effect, it upgrades thermal insulation performance of finished coatings. The product boasts good compatibility with putty binders and inorganic fillers, and maintains favorable scraping, sanding and polishing performance without causing obvious surface pores. It is a premium lightweight additive for interior wall putty, exterior thermal insulation putty and gypsum joint filler.

Core Features

Pre-expanded dry powder, directly usable
No secondary heating required, convenient for automatic batching in putty production.
Closed-cell hollow structure for lightweight & heat insulation
Greatly reduce putty density and improve thermal insulation capacity.
Control shrinkage and reduce cracks
Ease volume shrinkage during drying, minimize cracks on wall and joint surfaces.
Excellent construction performance
Keep good spreadability, easy to sand and polish after curing.
Broad raw material compatibility
Compatible with common putty formulas, suitable for dry powder putty and water-based joint compound.
Stable surface finishing effect
Less defects such as pinholes under reasonable dosage.

Product Specifications

Product Name: DE Grade Expanded Microspheres

CAS No: 38742-70-0

Appearance: White free-flowing dry powder

Core Function: Lightweight filling, density reduction, shrinkage control, thermal insulation

Applicable Systems: Wall putty, dry powder putty, gypsum board joint compound

Recommended Dosage: 2%–8% based on total formula weight, adjust according to target density

Application Scope

Suitable for interior wall putty, exterior thermal insulation putty, gypsum board joint compound, filling putty, decorative caulking materials. Widely used in residential decoration, commercial building renovation, prefabricated building interior finishing and construction energy-saving projects.

Usage Guide

Add microspheres in the later mixing stage. Adopt low-speed mixing to prevent microsphere shell breakage caused by high shear force. Avoid long-time violent stirring. Adjust dosage to balance lightweight effect, bonding strength and surface quality. Keep packaging tightly sealed to avoid moisture absorption during storage.

Packaging & Storage

Packaging: Moisture-proof composite bags or fiber drums with inner plastic liner.

Storage: Store in cool, dry and ventilated warehouse. Prevent dampness, heavy extrusion and direct sunlight.

Shelf Life: 12 months under proper dry storage conditions.

Our Advantages

Our DE Grade expanded microspheres feature complete spherical structure, stable particle size and consistent batch quality. Compared with traditional mineral fillers, lower addition achieves obvious lightweight and anti-crack effect. Factory direct supply, sufficient inventory, free sample testing and putty formulation technical support are available.

Previous : CAS 38742-70-0 Dry Expanded Hollow Polymer Microspheres Thermal Insulation Mortar Additive Next : Pre-expanded Microspheres CAS 38742-70-0 Ultra Low Density Filler for Composites Buoyancy Materials

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