Epoxy Molding Release Agent Solvent‑Based Semi‑Permanent Fluorosilicone is a solvent‑diluted reactive fluorosilicone formulation. After spraying onto cleaned mold surfaces and solvent evaporation, the fluorosilicone component undergoes thermal cross‑linking to form a dense, smooth low‑surface‑energy isolating film. This cured film supports multiple consecutive epoxy molding cycles without frequent re‑application. It helps molded epoxy components achieve excellent high‑gloss surface finish. Cruci

Product Detail

Product Detail Page: This semi‑permanent fluorosilicone release agent is produced by dissolving reactive fluorosiloxane base polymer together with cross‑linking catalyst in selected high‑purity organic solvent system. The mixed solution passes through fine filtration to remove insoluble impurities. Each production batch is inspected for solid content, solution stability, curing reactivity, multi‑release cycle endurance, gloss‑boosting performance and post‑coating residue testing before leaving the factory.

Epoxy molding and electronic encapsulation impose strict surface quality requirements on molded components. Conventional temporary solvent‑based release agents must be reapplied after every single molding run. Frequent spraying extends mold preparation time and reduces overall workshop throughput. Many ordinary semi‑permanent mold release agents leave silicone‑rich transfer residues on epoxy workpieces after demolding. These invisible residual contaminants cause fish‑eyes, craters, shrinkage holes and poor paint adhesion during subsequent painting and top‑coating. If the isolating film is uneven or partially damaged during continuous serial molding, molten epoxy compound adheres locally to mold cavities. Sticking leads to surface scratches, dents and blemishes on molded parts, while accumulated cured epoxy residues force time‑consuming mold cleaning and interrupt mass‑production.

When this solvent‑based fluorosilicone release agent is thinly and uniformly sprayed onto thoroughly cleaned mold cavities, the organic solvent evaporates rapidly under proper pre‑heating temperature. The reactive fluorosilicone starts cross‑linking reaction and forms a tightly‑bonded, smooth continuous isolating film on the metallic mold surface. This low‑surface‑energy boundary layer reduces interfacial adhesion between hot molten epoxy molding compound and mold steel. It enables several successive epoxy molding cycles without re‑spraying, realizing semi‑permanent releasing performance. The smooth cured mold‑surface film transfers a high‑gloss texture onto the finished epoxy molded parts. Optimized fluorosilicone molecular design effectively suppresses migration of releasing component onto the workpiece, minimizing transfer residues. Therefore molded epoxy components can proceed directly to sanding, priming and top‑painting workflows without complicated deep cleaning.

Proper spray coating thickness and complete thermal curing are critical for mold treatment. Insufficient coating dosage or incomplete cross‑linking curing causes premature failure of the isolating film, resulting in epoxy sticking and surface damage on molded components. Excessively thick coating increases the risk of trace fluorosilicone transfer and may still trigger paint defects. Pre‑production molding trials on customer actual production molds are strongly recommended before large‑scale workshop deployment. This release agent is compatible with various thermoset epoxy molding and encapsulation resin systems.

For processing operations, thoroughly clean all mold cavity surfaces; perform uniform thin spraying; maintain specified mold temperature to guarantee full cross‑link curing of fluorosilicone film before feeding epoxy molding compound.

Major application fields: semi‑permanent mold surface treatment for epoxy compression and transfer molding; high‑gloss releasing auxiliary for electronic epoxy encapsulation components; mold release material for epoxy parts requiring subsequent painting and coating.

Store the product in tightly‑sealed original containers within 12‑25℃. Keep away from heat, ignition sources and direct sunlight due to solvent‑based formulation.

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Epoxy Molding Release Agent Solvent-Based Semi-Permanent Fluorosilicone, High-Gloss No Residue Post-Painting

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.