This 6.0W/mK extreme thermal grease is a high‑performance silicone‑based thermal interface compound. The specially adjusted thixotropic filler system delivers prominent anti‑pump‑out capability. It is targeted for bare‑die TIM1.5 application of AI chips. The grease resists interface displacement caused by repeated thermal expansion‑contraction, sustains consistent heat conduction, and fulfils high‑reliability cooling requirements for advanced high‑power semiconductor chips.

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Product DetailsExtreme Thermal Grease 6.0W/mK CAS 63148‑62‑9, Anti‑Pump‑Out for Bare Die TIM1.5 AI Chip High‑Reliability CoolingThis extreme thermal grease is manufactured with refined silicone base fluid and multi‑graded high‑thermal‑conductivity inorganic fillers via high‑efficiency dispersion and homogenizing processes. Its customized rheological property focuses on anti‑pump‑out performance, which addresses a typical failure mode of thermal interface materials: grease being gradually squeezed out from the narrow gap between die and heat spreader during continuous thermal cycling.

When used as TIM1.5 layer on bare‑die AI chips, the grease forms a thin, continuous thermal transfer layer between exposed silicon die surface and the heat‑dissipation component. It fills micro‑surface irregularities, expels trapped insulating air, and establishes efficient heat conduction pathways for high‑heat‑flux AI processors. Under repetitive expansion and contraction stress generated by chip power surges and temperature fluctuations, the grease remains confined within the interface gap, resisting gradual extrusion and migration away from the cooling zone. This anti‑pump‑out characteristic prevents thermal degradation over long device service life and reduces the risk of local chip overheating.

The compound exhibits outstanding thermal stability. It suppresses oil bleeding and filler sedimentation under prolonged high‑temperature operation. It maintains good chemical inertness against silicon die, copper‑alloy heat spreaders, aluminium heat sinks and common packaging polymers without inducing corrosion or material degradation.

This thermal grease is suitable for automated precision dispensing in high‑volume advanced semiconductor module manufacturing. Precise control of coating thickness is mandatory; excessive layer thickness will increase thermal resistance and reduce cooling efficiency. Mixing with other thermal greases or unrelated lubricants must be avoided. Incompatible blending will destroy anti‑pump‑out rheology and degrade thermal conductivity. Store in tightly sealed original containers in cool, dry indoor warehouse. Protect from direct sunlight and sustained high‑temperature storage, to preserve paste property and guarantee high‑reliability cooling performance for AI chip assembly.

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Extreme Thermal Grease 6.0W/mK CAS 63148-62-9, Anti-Pump-Out for Bare Die TIM1.5 AI Chip High-Reliability Cooling

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.