This 5.2W/mK ultra‑high thermal grease is a grey silicone‑based thermal interface compound with non‑flowing thixotropic property. Optimized high‑loading thermally‑conductive filler system delivers outstanding heat‑transfer capability. It avoids grease sagging and dripping on vertical or inclined assembly surfaces, fills micro gaps between chips and heat‑dissipation structures, and offers durable cooling performance for MPU, power modules and high‑power semiconductor chips.

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Product DetailsUltra‑High Thermal Grease 5.2W/mK CAS 63148‑62‑9, Grey Non‑Flowing for MPU Power Module High‑Power Chip CoolingThis grey ultra‑high thermal grease is formulated with purified silicone base oil and a carefully graded blend of thermally conductive inorganic fillers through high‑shear dispersion and fine grinding procedures. It features strong thixotropic, non‑flowing rheological behaviour. Under static conditions the paste stays firmly in position without sagging or dripping; under clamping pressure during assembly, it can spread gently to form a thin uniform thermal transfer layer on the interface.

Applied between MPU dies, high‑power chips and corresponding heat spreaders or heat sinks, the grease fills tiny micro‑roughness cavities on metal and die surfaces, expels trapped insulating air, and builds continuous thermal conduction pathways. It rapidly dissipates concentrated heat generated during peak‑load chip operation and helps keep semiconductor junction temperature within safe working range. Its non‑flowing characteristic is especially valuable for power modules where components are mounted on inclined or vertical positions, eliminating failure risks caused by grease migration away from the thermal interface.

The material exhibits excellent resistance against long‑term thermal cycling from repetitive power‑on and power‑off. It effectively suppresses oil bleeding and filler sedimentation after sustained thermal stress. It maintains chemical inertness towards copper, aluminium alloy heat sink substrates and common module packaging plastics, and will not trigger metallic corrosion or accelerated polymer ageing.

It is applicable for automated dispensing during mass production of power modules, and also suitable for manual rework and maintenance of high‑power electronic assemblies. Operators should strictly control coating thickness; overly thick application will increase thermal contact resistance and weaken cooling efficiency. Do not blend this thermal grease with other thermal compounds or general lubricants. Incompatible mixing will break filler dispersion and degrade thermal conductivity and thixotropic performance. Store goods in tightly sealed original containers in cool, dry indoor warehouse. Keep away from direct sunlight and prolonged high‑temperature exposure to retain original grey paste property and consistent cooling performance for high‑power chip assembly.

Previous : High-Thermal Conductivity Grease 4.3W/mK CAS 63148-62-9, Low Thermal Resistance for CPU GPU Power Semiconductor TIM Next : Extreme Thermal Grease 6.0W/mK CAS 63148-62-9, Anti-Pump-Out for Bare Die TIM1.5 AI Chip High-Reliability Cooling

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Ultra-High Thermal Grease 5.2W/mK CAS 63148-62-9, Grey Non-Flowing for MPU Power Module High-Power Chip Cooling

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.