Fine hexagonal boron nitride powder, CAS 10043‑11‑5, D50 1.2 μm. It is manufactured through high‑temperature synthesis, purification, fine milling and precise air classification. This fine flaky h‑BN powder features outstanding thermal conductivity, good lubricating slip property and superior electrical insulation. It serves as multi‑functional additive for CPO optoelectronic packaging materials, acting as thermal filler, internal lubricant and insulating modifier inside resin and composite syst

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Product Detail PageHexagonal Boron Nitride Powder Fine CAS 10043‑11‑5, D50 1.2μm for CPO Thermal Filler Lubricant & InsulatingThis fine‑grade hexagonal boron nitride powder is produced by high‑temperature boron‑nitrogen synthesis, followed by purification, fine jet‑milling and multi‑stage air classification. Strict production control maintains typical flaky hexagonal crystal morphology, while limiting coarse oversized particles. The median particle size D50 is tightly controlled at 1.2 μm. Metallic and oxide‑based impurities are minimized to satisfy electronic‑grade requirements for optoelectronic packaging applications.

Thanks to its fine flaky particle structure, this h‑BN grade provides dual functions of thermal conduction and internal lubrication within polymer matrices. When incorporated into epoxy molding compound, potting resin or coating systems for CPO optoelectronic modules, fine BN particles form micro‑scale thermal transfer pathways. It improves overall thermal dissipation of cured resin composites, helping to dissipate localized hot‑spots generated by high‑density optical chips. The intrinsic lamellar slip characteristic delivers internal lubricating effect during molding processing, reducing melt friction inside the mould cavity, improving mold‑release behavior and lowering processing torque during compounding.

In insulating modification applications, h‑BN exhibits low dielectric constant and excellent electrical insulation. It helps to maintain high dielectric resistance of resin‑based packaging materials under continuous operating voltage for CPO assemblies. The fine particle dimension enables uniform dispersion within thin‑layer resin systems, which makes this powder suitable for thin‑film coating, underfill and micro‑encapsulation formulations where coarse filler particles are prohibited.

Custom silane surface modification is available for this fine hexagonal boron nitride powder. Surface treatment improves interfacial affinity between flaky BN particles and organic resin matrices, restraining agglomeration of ultrafine flakes during mixing. It can be blended with spherical alumina, aluminum nitride or coarse‑size boron nitride grades to develop hybrid thermal‑conductive filler systems. Formulators are able to tune thermal conductivity, lubricating property and suspension stability to match specific CPO encapsulation and coating recipes.

This hexagonal boron nitride powder possesses good chemical inertness under normal conditions. The finished powder should be stored in hermetically sealed, dry packaging to avoid moisture absorption and fine‑particle agglomeration. During weighing, conveying and batching procedures, cross‑contamination with coarse ceramic powders must be strictly prevented. Coarse foreign grit will damage thin‑layer resin products and impair fine‑dispersion performance. This fine‑grade hexagonal boron nitride powder is a multi‑functional ceramic additive for CPO thermal filler, internal lubricant and insulating modification of advanced optoelectronic packaging composite materials.

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Hexagonal Boron Nitride Powder Fine CAS 10043-11-5, D50 1.2μm for CPO Thermal Filler Lubricant & Insulating

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.