Hexagonal Boron Nitride Powder Coarse CAS 10043-11-5, D50 8.5μm for CPO High-Thermal Filler & Isotropic Potting
Coarse hexagonal boron nitride powder, CAS 10043‑11‑5, D50 8.5 μm. Produced via high‑temperature synthesis, thermal annealing, crushing and multi‑step air classification. This flaky coarse h‑BN powder delivers prominent thermal conductivity and outstanding dielectric performance. It is applied as high‑thermal inorganic filler for CPO isotropic potting resin, enhancing heat‑spreading capacity and mitigating thermal‑induced internal stress inside high‑density optoelectronic packaging assemblies.
Product Detail PageHexagonal Boron Nitride Powder Coarse CAS 10043‑11‑5, D50 8.5μm for CPO High‑Thermal Filler & Isotropic PottingThis coarse‑grade hexagonal boron nitride powder is manufactured through high‑temperature solid‑state synthesis, thermal annealing for crystal growth, mechanical crushing, de‑agglomeration and multi‑stage air classification. The median particle size D50 is precisely controlled at 8.5 μm. Rigorous purification processes reduce residual boron‑oxide and metallic contaminants to meet electronic‑grade specifications. Well‑developed flaky hexagonal crystal grains are formed during thermal annealing, which endows the powder with superior intrinsic in‑plane thermal conduction performance.
When deployed as thermal filler within CPO isotropic potting resin systems, this coarse flaky h‑BN powder builds interconnected thermal conduction networks inside cured potting compounds. It efficiently dissipates concentrated heat generated from high‑power optical chips within CPO modules. Proper particle‑size grading helps to reduce overall thermal expansion coefficient of the potting composite, alleviating cyclic thermal‑mechanical stress that occurs during continuous on‑off operation of optoelectronic devices. It effectively lowers the risk of internal micro‑cracks and interfacial delamination between potting resin and optoelectronic components.
Due to its relatively larger flake dimension compared with fine‑grade h‑BN, this coarse boron nitride contributes to higher thermal conductivity contribution at moderate loading. Nevertheless, uncontrolled orientation of flaky platelets may bring anisotropic thermal performance. For isotropic potting formulations, formulators need to combine this coarse h‑BN with other spherical ceramic fillers to offset orientation effects and achieve balanced isotropic thermal spreading behavior for CPO packaging modules.
Custom silane surface modification can be conducted upon request. Surface coating improves wetting and interfacial adhesion between flaky boron nitride particles and epoxy or silicone potting matrices. It suppresses void generation at the particle‑resin interface, enhances moisture resistance and improves mechanical strength of cured potting parts. This coarse‑grade h‑BN can be compounded with fine h‑BN, spherical alumina or aluminum nitride powder to create multi‑modal graded filler blends, adjusting viscosity, maximum filling loading and overall thermal‑mechanical properties for customized CPO potting recipes.
The powder requires hermetically sealed dry storage to prevent moisture‑triggered agglomeration of flaky particles. During weighing, pneumatic conveying and batching operations, cross‑contamination with ultrafine boron nitride or other abrasive ceramic powders should be avoided. Uncontrolled particle‑size mixing will disturb the designed particle‑size grading and negatively affect the rheological and thermal performance of potting resin. This coarse hexagonal boron nitride powder serves as a premium high‑thermal ceramic filler for isotropic potting compounds applied in high‑reliability CPO optoelectronic packaging.
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Hexagonal Boron Nitride Powder Coarse CAS 10043-11-5, D50 8.5μm for CPO High-Thermal Filler & Isotropic Potting
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