High‑Temp Encapsulation Release Powder Montan Wax/PTFE Blend is a solid composite release additive combining refined montan wax and low‑molecular‑weight PTFE powder. Synergistic combination improves thermal stability compared with conventional single wax‑type release agents. During high‑pressure encapsulation molding above 300℃, it achieves moderate migration toward mold interface to form a thin lubricating isolating layer. It features low bleed property to minimize surface exudation. It is suit

Product Detail

Product Detail Page: This composite release powder is produced by precision melt‑blending of purified montan wax and high‑purity PTFE, followed by cooling, pulverization and air‑jet classification. Each production batch is strictly tested for melting range, thermal decomposition temperature, particle‑size distribution, bleeding tendency, mold‑release efficiency and compatibility with epoxy resin prior to delivery.

Electronic packaging encapsulation molding is performed at elevated temperature and pressure. Ordinary single montan wax release agents suffer from premature thermal decomposition when operating above 300℃. Thermal decomposition creates carbonized deposits on mold cavities, resulting in dark spots and cosmetic defects on molded packages. Pure PTFE powder often encounters poor compatibility within thermoset resin matrix, which leads to uneven dispersion and surface specks on finished components. If internal release additive exhibits high‑bleed behaviour, heavy surface blooming contaminates the package surface. Such contamination impairs subsequent wire bonding, marking and soldering, and brings hidden long‑term reliability risks for electronic devices. Insufficient release performance will cause sticking of cured encapsulation resin to mold inserts, triggering package chipping, cracking and frequent mold cleaning, which lowers overall production efficiency of the packaging workshop.

When this blended release powder is homogeneously incorporated into electronic encapsulation resin system at recommended loading during compounding, fine composite particles disperse uniformly throughout the resin matrix. Under high‑temperature and high‑pressure encapsulation molding conditions exceeding 300℃, controlled partial migration occurs toward the metal mold surface, building a thin continuous lubricating boundary film. This interfacial film reduces adhesive force between cured molding compound and mold steel, allowing clean demolding of electronic packages. The synergistic formula elevates overall thermal resistance. It suppresses thermal carbonization while maintaining low‑bleed characteristics, limiting undesirable surface exudation on molded parts. It helps to reduce mold fouling and preserve surface quality of finished electronic packaging components.

Precise loading dosage is essential during compound formulation. Under‑dosage yields inadequate releasing performance, resulting in package sticking, chipping and more frequent mold cleaning cycles. Excessive dosage aggravates bleeding risk and may negatively influence curing behaviour, mechanical strength and long‑term reliability of electronic packaging. Molding trials together with surface‑bleed inspection and reliability testing are strongly required before mass‑scale production. This montan wax‑PTFE blended release powder can be compounded with epoxy resin, curing agents and inorganic mineral fillers for EMC and other thermoset electronic encapsulation materials.

For processing operations, meter the release powder and feed into high‑speed mixing and kneading equipment during compound preparation under low‑dust production conditions for electronic‑grade materials.

Major application fields: low‑bleed internal release additive for high‑temperature epoxy transfer encapsulation; composite functional processing powder for semiconductor and electronic packaging molding; anti‑fouling lubricant for thermoset electronic encapsulation compound.

Store the product in tightly‑sealed original bags within 15‑25℃, maintain dry low‑dust warehouse storage, avoid direct sunlight and prolonged high‑temperature storage to prevent caking

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High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.