Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive developed for epoxy molding compound used in semiconductor IC encapsulation. It features well‑balanced compatibility with epoxy resin, curing agents and inorganic silica fillers. During high‑temperature transfer molding, the additive migrates moderately toward the mold‑metal interface to build an ultra‑thin lubricating isolation layer for clean demolding. Strict molecular design minimizes excessive surf

Product Detail

Product Detail Page: This EMC internal release agent is produced by organic synthesis and high‑purity refining process. Low‑molecular‑weight fractions and trace metal ion impurities are removed by vacuum distillation and fine filtration. Every production batch undergoes comprehensive quality testing, including melting point, thermal stability, epoxy compatibility, mold‑release efficiency, wire‑bonding strength verification, solderability test and high‑humidity accelerated ageing assessment before shipment.

Semiconductor IC packaging with epoxy transfer molding imposes extremely stringent requirements on internal processing additives. Conventional general‑purpose release agents tend to over‑migrate to the package surface under high‑temperature molding conditions. Surface blooming forms a thin contaminant film on the package exterior. This contaminant layer seriously weakens wire‑bonding adhesion during subsequent assembly, causes solder wetting issues, and triggers delamination failure under high‑humidity and thermal shock conditions, resulting in severe hidden reliability risks for finished IC devices. If the release efficiency is inadequate, cured EMC adheres tightly to precision mold cavities. Package chipping, edge cracking and frequent mold cleaning will occur, which reduces the production throughput of the packaging workshop. Some release additives also interfere with epoxy cross‑linking curing reaction, altering curing speed and mechanical properties of the cured encapsulation material.

When this internal release agent is homogenously kneaded into the EMC formulation at the recommended loading dosage, it maintains stable dispersion within the uncured epoxy matrix. Under high temperature and high pressure inside the transfer molding tool during the encapsulation cycle, only a controlled fraction of the additive migrates towards the mold surface to construct an ultra‑thin lubricating boundary film. This boundary layer reduces interfacial adhesion between cured epoxy molding compound and mold steel, enabling smooth demolding of finished IC packages. The majority of the additive remains uniformly dispersed inside the cured epoxy network. It does not disturb the epoxy curing reaction, avoids harmful surface blooming, preserves original wire‑bonding performance, solderability and moisture resistance, and safeguards long‑term packaging reliability of semiconductor components.

Accurate dosage control during EMC compounding is critical. Under‑dosage leads to insufficient mold‑release capacity, package sticking, chipping and increased mold‑cleaning frequency. Excessive addition causes undesirable surface blooming, which impairs wire‑bonding and soldering performance and introduces latent reliability risks for encapsulated chips. Complete validation including molding trial, wire‑bonding testing and accelerated ageing reliability evaluation must be completed before large‑scale EMC manufacturing. This release agent can be compounded together with epoxy resin, curing agent, fused silica fillers and other functional additives for electronic‑grade epoxy molding compound.

For processing operations, meter the release agent and feed it into high‑speed mixing and kneading equipment during EMC raw‑material compounding in a low‑dust electronic‑grade production environment.

Major application fields: internal release additive for transfer‑molding epoxy molding compound for memory chips, logic ICs and power semiconductors; functional processing auxiliary for high‑reliability semiconductor packaging materials; non‑interfering lubricant for EMC formulation development.

Store the product in tightly‑sealed original packaging within 15‑25℃, maintain low‑dust dry warehouse conditions, avoid direct sunlight and long‑term thermal exposure.

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Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.