High‑Temperature Fiberglass Release Agent Phenyl Silicone CAS 63148‑58‑3 is a specialty phenyl‑modified silicone formulated for high‑temperature molding of glass‑fiber‑reinforced plastics. The introduction of phenyl groups onto silicone backbone significantly improves thermal stability compared with conventional methyl‑silicone products. During high‑temperature compression or injection molding, it forms a uniform thin isolating film on mold surfaces. It provides reliable demolding performance at

Product Detail

Product Detail Page: This phenyl silicone release agent is synthesized via controlled ring‑opening polymerization of phenyl‑containing siloxane monomers. The crude material goes through vacuum devolatilization and fine filtration to eliminate low‑molecular‑weight siloxane fractions. Each production batch is strictly tested for viscosity, phenyl group content, thermal resistance, decomposition temperature, mold‑release efficiency and carbonization resistance before shipment.

Molding processes for glass‑fiber‑reinforced plastics often run at elevated mold temperatures. Ordinary methyl‑based silicone release agents suffer from thermal decomposition under prolonged exposure above 220℃. Thermal cracking generates carbonized black deposits adhering to mold cavities. These carbon contaminants create dark spots, streaks and surface defects on molded fiberglass‑reinforced components. Frequent mold disassembly and manual cleaning is required, which lowers production output and increases operating cost. Meanwhile, many non‑silicone high‑temperature release agents have poor spreadability on polished mold steel, resulting in incomplete isolating film and severe part sticking during demolding.

When the phenyl silicone release agent is applied by spraying or wiping onto pre‑heated mold surfaces prior to molding, it spreads evenly across the metallic cavity and forms a continuous thin silicone isolating layer. This lubricating film reduces interfacial adhesion between hot molten glass‑fiber‑filled plastic compound and mold steel. It enables smooth demolding of rigid GF‑reinforced molded parts. Benefiting from the phenyl‑modified molecular backbone, the release agent resists thermal degradation and carbonization even under sustained operating temperature reaching 300℃. It minimizes black carbon fouling on mold surfaces, extends effective mold running cycles between cleaning intervals. The isolating layer also helps to improve surface smoothness of fiberglass‑reinforced finished components.

Strict control of coating thickness is critical for practical molding operations. Insufficient coating forms a discontinuous isolating film and causes sticking, scratching and surface tearing on molded fiberglass parts. Excessively thick coating may induce silicone migration onto the finished workpiece surface, which could negatively affect subsequent painting and adhesive bonding. Actual molding trial on target production tooling is strongly recommended before mass manufacturing. This phenyl silicone release agent can be used for thermoplastic and thermoset glass‑fiber‑reinforced molding workflows.

For processing operations, apply uniform thin coating by spray gun or fabric wiping on clean, pre‑heated mold cavity surfaces before charging the fiberglass reinforced molding compound.

Major application fields: high‑temperature mold release for glass‑fiber‑reinforced thermoplastic injection molding; release treatment for thermoset fiberglass compression molding; anti‑carbonization mold auxiliary for continuous high‑run fiberglass part production.

Store the product in tightly‑sealed original containers within 15‑28℃, keep dry warehouse conditions, avoid direct sunlight and excessive thermal storage.

Previous : Epoxy Molding Compound Release Agent for Chip Encapsulation, High-Temp No Residue Packaging Reliability Next : Water‑Based Fiberglass Mold Release Agent Silicone‑Fluoro Emulsion, Multi‑Release Eco for FRP Compression Molding

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

High-Temperature Fiberglass Release Agent Phenyl Silicone CAS 63148-58-3, 300℃ No Carbonization for GF-Reinforced Plastic

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.