Epoxy Molding Compound Release Agent is a specialty high‑temperature resistant release additive designed for epoxy molding compound used in semiconductor chip encapsulation. It is compatible with epoxy resin, curing agent and inorganic filler system of EMC. During high‑pressure transfer molding, it migrates moderately to the mold interface and forms an ultra‑thin lubricating isolation layer for smooth demolding of molded semiconductor packages. It is formulated to avoid stubborn surface residues

Product Detail

Product Detail Page: This EMC release agent is manufactured through organic synthesis and high‑purity refining, followed by filtration to remove particulate impurities and trace metal ions. Finished batches are tested for melting behaviour, thermal decomposition temperature, compatibility with epoxy matrix, mold‑release efficiency, surface residue inspection, wire‑bonding influence evaluation and high‑humidity accelerated ageing test before release for shipment.

Semiconductor chip encapsulation by epoxy transfer molding imposes strict requirements on functional additives. Conventional general‑purpose mold release additives tend to separate excessively during high‑temperature molding. Heavy migration creates persistent residues on the surface of molded packages. Such residues cause poor solderability, weaken lead‑free soldering performance and interfere with subsequent wire bonding operation, resulting in reliability risks for finished semiconductor devices. If release efficiency is insufficient, the cured epoxy molding compound adheres firmly to precision mold cavities. It brings package chipping, package cracking and frequent mold cleaning cycles, which reduces the overall throughput of the packaging workshop. Many common high‑temperature lubricants also show thermal carbonization under EMC molding temperatures, generating black spots and cosmetic defects on the exterior of semiconductor packages.

When this release agent is homogenously blended into epoxy molding compound during compound formulation at recommended loading, it stays well‑dispersed within the uncured epoxy matrix. Under the combined action of high temperature and pressure inside the transfer molding tool during encapsulation cycle, a controlled portion of the additive migrates towards the metal mold surface to construct an ultra‑thin lubricating isolating film. This thin interfacial layer reduces adhesion between cured epoxy molding compound and mold steel, enabling clean demolding of the finished semiconductor package. The majority of additive remains distributed inside the epoxy system without heavy surface exudation. It resists thermal carbonization at typical EMC molding temperatures, avoids surface contamination and black speck defects. It does not negatively affect epoxy curing behaviour, moulded package solderability and long‑term anti‑humidity performance, thus safeguarding overall semiconductor packaging reliability.

Precise loading dosage is essential during EMC compounding. Under‑dosage results in inadequate mold‑release performance, package chipping, sticking and increased frequency of mold cleaning. Excessive addition leads to undesirable surface blooming, which impairs wire bonding and soldering properties and introduces hidden reliability risks for encapsulated chips. Formal process validation including molding trial, wire‑bonding test and accelerated ageing reliability testing is strongly required before large‑scale EMC production. This release agent can be compounded with epoxy resin, curing agents, silica fillers and other functional additives for semiconductor‑grade epoxy molding compound.

For compounding operations, the release agent is metered and incorporated during the high‑speed mixing and kneading stage of epoxy molding compound manufacturing. Production environment should maintain low‑dust conditions suitable for electronic‑grade materials.

Major application fields: internal release processing additive for transfer‑mold epoxy molding compound in semiconductor chip encapsulation; functional auxiliary for IC packaging EMC formulation; high‑temperature non‑residue lubricant for precision semiconductor molding.

Store the product in tightly‑sealed original packaging within 15‑25℃, maintain dry low‑dust warehouse storage, avoid direct sunlight and thermal exposure.

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Epoxy Molding Compound Release Agent for Chip Encapsulation, High-Temp No Residue Packaging Reliability

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.