High‑Temperature IC Encapsulation Release Agent Fluorosilicone is a high‑heat‑resistant fluorosilicone formulated for harsh high‑temperature IC encapsulation molding conditions. Its modified fluorinated‑siloxane molecular backbone delivers outstanding thermal stability. At peak working temperature up to 350℃, it resists thermal decomposition and avoids carbon build‑up on mold cavities. It forms a uniform ultra‑thin lubricating isolating layer during epoxy molding compound transfer molding. It fa

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Product Detail Page: This fluorosilicone release agent is synthesized via fluorosiloxane polycondensation, followed by high‑vacuum devolatilization and precision filtration to eliminate low‑molecular‑weight volatile siloxane fractions and trace metallic impurities. Each production batch undergoes strict quality testing including viscosity, thermal gravimetric analysis, decomposition temperature evaluation, mold‑release efficiency, carbon‑deposit resistance inspection and compatibility testing with epoxy molding compound prior to shipment.

IC encapsulation transfer molding runs under continuous high‑temperature and high‑pressure conditions inside precision molds. Conventional silicone‑based release agents start to thermally decompose when sustained above 280℃. Thermal cracking produces carbon residues that deposit onto delicate mold cavities. Hard carbon fouling generates black specks, blemishes and cosmetic defects on molded IC packages. Heavy carbon contamination also scratches package surfaces, leads to rejected components, and requires frequent mold disassembly for mechanical cleaning, which interrupts mass packaging production and raises manufacturing costs. Many standard high‑temperature release additives also contain trace ionic impurities, which potentially create hidden reliability risks for finished semiconductor devices.

When this fluorosilicone release agent is applied onto cleaned mold cavity surfaces before molding, it spreads evenly to create a continuous ultra‑thin lubricating isolating film. During high‑pressure transfer‑molding cycles at elevated temperature, this interfacial film reduces adhesion between molten epoxy molding compound and mold steel. It enables smooth demolding of completed IC packages. Benefiting from the fluorine‑modified siloxane molecular structure, the release agent maintains chemical stability even at 350 ℃, resisting molecular breakdown and preventing stubborn carbon build‑up on mold surfaces during long continuous molding runs. It reduces mold‑cleaning downtime and helps maintain consistent cosmetic quality of encapsulated IC parts.

Controlling coating thickness is critical for molding operations. Insufficient coating results in discontinuous isolating film, causing package sticking, chipping and surface tearing upon demolding. Excessive coating thickness may leave trace fluorosilicone residues on the exterior of IC packages, which negatively impacts subsequent marking, soldering and lead bonding procedures. Actual molding validation trials on customer production molds are strongly recommended before mass‑scale deployment. This fluorosilicone release agent can be used for EMC transfer molding of memory chips, power ICs and discrete semiconductor components.

For processing operations, spray or wipe a thin uniform layer on thoroughly cleaned mold cavities; ensure proper pre‑heating before loading epoxy molding compound.

Major application fields: anti‑carbonization mold release for high‑temperature IC epoxy transfer encapsulation; mold‑treatment auxiliary for power semiconductor packaging; high‑heat‑resistant fluorosilicone processing aid for continuous semiconductor molding production.

Store the product in tightly‑sealed original containers within 15‑25℃, maintain low‑dust warehouse environment, avoid direct sunlight and long‑term over‑heating storage.

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High-Temperature IC Encapsulation Release Agent Fluorosilicone, 350℃ No Decomposition No Carbon Build-Up

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.