Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043‑11‑5 is a high‑purity composite inorganic functional powder. It combines layered lubricating property of hexagonal boron nitride with high‑rigidity nano‑silica. Surface modification optimizes dispersion inside rubber and polymer matrix. During high‑temperature molding and vulcanization, it delivers solid lubrication and internal mold‑release effect. It avoids carbon‑forming decomposition risks common to organic wax‑based relea

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Product Detail Page: This composite release powder is produced by mixing nano‑silica with fine‑grade hexagonal boron nitride powder, followed by controlled dry‑phase surface modification, homogenization and air‑jet classification. Each production batch is tested for particle‑size distribution, loose bulk density, thermal stability, lubricating property, dispersion performance and impurity content before shipment.

Precision rubber and electronic polymer molding present strict technical challenges. Conventional organic wax‑based internal release agents may undergo thermal decomposition at elevated vulcanization or molding temperatures. Decomposition creates carbon residues, stains and volatile contaminants, which are unacceptable for high‑grade electronic rubber parts. Liquid silicone release agents risk surface migration residues that impair subsequent bonding, printing and coating. When internal solid release powder shows poor dispersion inside rubber or polymer compound, agglomerated particles form surface blemishes, pinholes and uneven texture on finished precision components. Severe mold fouling forces frequent mold cleaning and lowers production output for electronic‑grade molding.

When this inorganic nano release powder is uniformly incorporated into rubber or polymer compound during mixing and kneading at recommended loading, the fine composite particles disperse evenly throughout the material matrix. At elevated molding or vulcanization temperature, part of the powder migrates moderately toward the metal‑mold interface and builds a micro‑scale solid lubricating boundary layer. This inorganic boundary layer reduces interfacial adhesion between hot polymer stock and mold cavity surfaces, enabling smooth demolding of intricately‑shaped precision rubber and electronic molded articles. Owing to its fully inorganic composition, the powder exhibits excellent thermal stability, without thermal decomposition or carbon‑related fouling during molding cycles. It helps to reproduce delicate mold surface textures on finished workpieces and slows the accumulation of molding residues inside the mold.

Precise addition dosage must be strictly controlled during compounding. Under‑dosage results in insufficient lubrication and release performance, causing sticking, tearing and surface defects on precision molded parts. Excessive loading will negatively affect mechanical properties such as tensile strength, elongation and compression‑set resistance of rubber and electronic polymer components. Material validation and molding trials are strongly recommended prior to formal mass‑scale production. This inorganic nano release powder can be compounded with rubber vulcanizing systems, reinforcing fillers and polymer processing additives for electronic‑grade formulations.

For processing operations, meter the powder into internal kneader or high‑speed mixer together with polymer, rubber base and other reinforcing fillers during compound preparation.

Major application fields: internal inorganic release additive for precision technical rubber molded components; solid lubricating filler for electronic polymer molding compounds; anti‑fouling functional powder for high‑grade rubber‑electronics composite molding.

Store the product in tightly‑sealed original bags within 15‑28℃, keep dry, avoid moisture absorption and heavy mechanical compression which may cause particle agglomeration.

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Inorganic Nano Release Powder Silica/Boron Nitride Modified CAS 10043-11-5, Precision Rubber & Electronic Molding

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.