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(JSYAPG-9222) Alumina Polishing Slurry Polycrystalline Alpha CAS 1344-28-1, for Sapphire C-Face, Hard Alloy & Ceramic

JSYAPG‑9222 polycrystalline alpha alumina polishing slurry is a water‑based precision polishing suspension. Polycrystalline alpha‑alumina abrasive serves as the core functional ingredient, combined with specialized dispersants, lubricants and anti‑settling stabilizers. This slurry is developed for surface finishing of sapphire C‑face wafers, cemented hard alloy and high‑density structural ceramics. The unique polycrystalline abrasive microstructure produces progressive micro‑cutting action inste

Product Detail Page: JSYAPG‑9222 polishing slurry adopts specially synthesized polycrystalline alpha‑alumina abrasive. Unlike conventional single‑crystal alumina grit, each polycrystalline particle consists of multiple fine crystallite domains. During polishing, the particle will gradually self‑fracture to continuously expose fresh fine cutting edges. This self‑sharpening characteristic maintains stable cutting efficiency throughout the polishing cycle without generating oversized sharp fragments. Multi‑stage classification and fine filtration are carried out during slurry production to eliminate oversized grit and hard agglomerates. Strict raw‑material purification reduces heavy‑metal impurities to avoid surface discoloration and staining on finished workpieces. Optimized suspension‑stabilizing additives restrain rapid sedimentation of dense alumina particles inside the aqueous system.

Sapphire C‑face wafer is the primary epitaxy substrate for LED chip production. After rough grinding, the wafer surface retains grinding marks and subsurface micro‑cracks. If deep residual damage remains after polishing, crystal defects will propagate into the subsequent GaN epitaxial layer and reduce LED luminous performance and product yield. Cemented hard‑alloy moulds, cutting tools and structural ceramic components demand fine, scratch‑free surfaces after precision finishing. Deep scratches will act as stress‑concentration points under mechanical loading, initiating micro‑fracture and shortening service life of these hard components.

Thanks to the self‑sharpening behavior of polycrystalline alpha‑alumina abrasive, this slurry achieves effective material removal rate, meanwhile it mitigates heavy subsurface lattice damage on hard brittle workpieces. The formulated lubricating component reduces frictional heat generated at the contact interface between polishing pad and workpiece. It helps to suppress thermal stress‑induced micro‑cracks during high‑speed planarization. This slurry is applicable on single‑side polishing machines and double‑sided lapping‑polishing equipment for mass‑production processing.

Process technicians can dilute the concentrated stock slurry with deionized water to adjust effective abrasive loading. Polishing performance can be further optimized by tuning processing parameters including polishing down‑force, platen rotation speed and slurry circulation feed‑rate according to different workpiece materials and target surface roughness requirements.

Foreign chemical contamination, prolonged high‑temperature storage and freezing must be strictly avoided. Freezing will break the suspension system and trigger irreversible hard sedimentation of dense alumina particles. Once heavy hard sediment forms and cannot be fully re‑dispersed by agitation, the slurry is no longer suitable for precision polishing operations.

Major application fields include sapphire C‑face wafer precision polishing for LED substrates, surface finishing of cemented hard‑alloy cutting tools and mould inserts, super‑finishing of dense structural technical ceramic components.

Store the product in tightly‑sealed original plastic drums within 5‑30℃. Prevent direct sunlight and freezing environments. Gentle circulation or agitation is recommended before use for long‑term stored batches.


(JSYAPG-9222) Alumina Polishing Slurry Polycrystalline Alpha CAS 1344-28-1, for Sapphire C-Face, Hard Alloy & Ceramic
JSYAPG‑9222 polycrystalline alpha alumina polishing slurry is a water‑based precision polishing suspension. Polycrystalline alpha‑alumina abrasive serves as the core functional ingredient, combined with specialized dispersants, lubricants and anti‑settling stabilizers. This slurry is developed for surface finishing of sapphire C‑face wafers, cemented hard alloy and high‑density structural ceramics. The unique polycrystalline abrasive microstructure produces progressive micro‑cutting action inste
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(JSYAPG-9222) Alumina Polishing Slurry Polycrystalline Alpha CAS 1344-28-1, for Sapphire C-Face, Hard Alloy & Ceramic

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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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