JSYAPG‑AS40 ammonium‑stabilized colloidal silica slurry is water‑based amorphous nano‑silica sol with 40 wt% SiO₂ solid content. Adopting ammonium‑ion stabilization instead of sodium‑based stabilizer, this product achieves sodium‑free property with strictly controlled trace heavy‑metal impurities. Spherical silica nanoparticles deliver stable abrasive performance for semiconductor wafer CMP. It can be applied directly or diluted with ultra‑pure deionized water to satisfy different electronic‑gra

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Product Detail Page: JSYAPG‑AS40 ammonium‑stabilized colloidal silica slurry consists of amorphous spherical silica nanoparticles evenly dispersed in high‑purity deionized water. Ammonium ions provide surface electrostatic repulsion for silica particles to maintain stable suspension status, effectively restraining particle flocculation and sedimentation under proper storage. The production process adopts strict purification procedures to minimize residual metallic impurities. Without sodium ion, the product avoids alkali‑metal ionic contamination on wafer surfaces.

During semiconductor wafer CMP processing, sodium contamination is a critical failure factor for microelectronic devices. Residual sodium ions may migrate inside chip structures, causing gate leakage, parameter drift and long‑term reliability degradation of finished semiconductors. This sodium‑free ammonium‑stabilized silica slurry greatly reduces such failure risks. Uniform spherical particles provide balanced material removal capacity while lowering micro‑scratch occurrences on wafer surface.

The slurry exhibits stable viscosity at normal ambient temperature. Formulation technicians are allowed to dilute the stock slurry with ultra‑pure deionized water to adjust working solid concentration for different CMP processes.

Strong acidic environment, persistent high‑temperature storage and freezing conditions must be strictly avoided. These extreme conditions will disrupt the ammonium‑based electrostatic stabilization system, triggering irreversible gelation, flocculation and precipitation of silica particles. Gelled slurry cannot be reworked for production.

Major application fields include advanced semiconductor wafer CMP polishing, high‑precision optical component finishing, electronic ceramic processing and high‑purity binder for functional inorganic coatings.

Store the product in tightly‑sealed original plastic containers within 5‑35℃. Keep away from direct sunlight and freezing. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid delivery. Gentle periodic circulation is suggested for long‑term inventory to slow down bottom sediment build‑up.

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(JSYAPG-AS40) Colloidal Silica Slurry Ammonium-Stabilized 40% CAS 112926-00-8, Sodium-Free Low-Metal CMP for Semiconductor Wafer

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.