JSYAPG‑TM50 colloidal silica slurry is water‑based amorphous silica sol with average particle size of 22 nm and 50 wt% SiO₂ solid content. Adopting optimized electrostatic stabilization technology, this high‑concentration silica slurry avoids particle agglomeration at high solids. Larger‑size spherical nanoparticles provide strong abrasive capacity for rough polishing procedures on wafer and glass. The concentrated slurry can be used directly or diluted with deionized water to meet different rou

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Product Detail Page: JSYAPG‑TM50 colloidal silica slurry is composed of amorphous spherical silica nanoparticles homogeneously dispersed in deionized water. Advanced synthesis and stabilization process keeps stable suspension performance at the high 50% solid loading. Sufficient electrostatic repulsion between silica particles suppresses flocculation and heavy sedimentation within valid shelf‑life. The average particle size is strictly controlled at 22 nm with controlled particle‑size distribution, ensuring stable abrasive efficiency from batch to batch.

For wafer rough polishing operations, the relatively larger silica particles offer higher mechanical grinding action. It rapidly removes thick damaged surface layers generated by previous slicing and lapping processes, significantly boosting material removal rate and improving overall production throughput. It is dedicated for rough removal stage before fine polishing instead of ultra‑fine finishing.

In glass rough polishing applications, the slurry quickly eliminates deep grinding marks, surface scratches and uneven texture on glass blank surfaces. It shortens processing cycle for optical glass and display‑grade glass substrates.

This high‑solids concentrated silica slurry provides great formulation flexibility. Operators can dilute the raw slurry with qualified deionized water to adjust working solid content according to targeted polishing processes.

Strictly avoid exposure to strong acid, continuous high‑temperature conditions and freezing. These harsh surroundings will destroy the colloidal balance, resulting in irreversible gelation, flocculation and hard silica sediment. Once gelled, the slurry cannot be re‑dispersed for production usage.

Primary application areas include silicon wafer rough polishing, optical glass blank rough grinding, display glass pre‑polishing, ceramic substrate coarse planarization and industrial rough‑polishing concentrate.

Store inside tightly‑sealed original plastic containers within 5‑35℃ storage temperature. Prevent direct sunlight and freezing. Standard industrial packaging covers plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term storage to reduce bottom sediment accumulation.

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(JSYAPG-TM50) Colloidal Silica Slurry Large-Particle 22nm 50% CAS 112926-00-8, High-Rate Rough Polish for Wafer & Glass

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.