JSYAPG‑COMPOL80 colloidal silica polishing slurry is a high‑precision finishing slurry developed for hard brittle crystal and ceramic substrates. Spherical high‑purity colloidal silica nanoparticles serve as the core abrasive, matched with specialized pH regulators and surface lubricating additives. It realizes damage‑free polishing on lithium tantalate, lithium niobate, sapphire, selected metal and ceramic substrates. This slurry minimizes subsurface micro‑cracks and scratches. Concentrated sto

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Product Detail Page: JSYAPG‑COMPOL80 polishing slurry consists of spherical amorphous colloidal silica nanoparticles evenly dispersed in ultra‑pure aqueous medium. Multi‑stage fine filtration is performed during production to eliminate oversized coarse particles. Rigorous purification workflow reduces ionic and heavy‑metal contaminants, which is essential for high‑grade optical and electronic substrate processing. Optimized surface‑charge stabilization inhibits nanoparticle agglomeration and sedimentation, ensuring consistent polishing performance across different production batches.

Lithium tantalate and lithium niobate are brittle ferroelectric crystal materials widely used for optical communication and radio‑frequency wafer devices. These crystals are highly susceptible to subsurface damage, micro‑cracks and cleavage during mechanical grinding. The spherical silica abrasive executes soft chemical‑mechanical removal instead of aggressive cutting action. It effectively reduces subsurface residual damage after polishing, helping to preserve the intrinsic crystal property of the finished wafer.

For sapphire substrate polishing, this slurry achieves gradual material removal on hard sapphire surfaces. It helps to obtain ultra‑smooth finished surfaces, which is critical for LED‑grade sapphire substrate finishing. When applied to dense technical ceramic and selected hard‑metal substrates, the balanced combination of mild mechanical abrasion and surface chemical modification removes grinding traces without introducing new deep scratches.

The integrated lubricating additives lower friction between polishing pad and substrate surface during planarization. This feature suppresses localized thermal spikes generated at the polishing interface and further mitigates the risk of thermally induced micro‑cracks on brittle crystalline workpieces.

Process technicians can dilute the concentrated stock slurry with ultra‑pure deionized water to adjust abrasive concentration. Working parameters can be adapted for different polishing equipment, polishing pressure and platen speed according to production recipes for crystal, ceramic and metal substrates.

Strong‑acid or strong‑alkali contamination, prolonged high‑temperature storage and freezing must be strictly avoided. Harsh conditions will break colloidal stability, leading to irreversible particle flocculation, sedimentation and gelation. Once deteriorated, the slurry cannot be reused for precision polishing.

Major application fields include LiTaO₃ and LiNbO₃ ferroelectric wafer finishing, sapphire LED substrate polishing, advanced technical‑ceramic substrate planarization, hard‑metal precision super‑finishing for optical and electronic component manufacturing.

Store the product in tightly‑sealed original plastic containers within 5‑30℃. Prevent direct sunlight and freezing environments. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid shipment. Gentle periodic circulation is recommended for long‑term inventory to slow down bottom sediment accumulation.

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(JSYAPG-COMPOL80) Colloidal Silica Polishing Slurry for LiTaO₃/LiNbO₃, Sapphire, Metal & Ceramic Substrate, Damage-Free

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.