Nano Cerium Oxide Polishing Powder, CAS 1306‑38‑3. It is synthesized by wet‑chemical precipitation, controlled calcination, de‑agglomeration and fine classification. This ultrafine rare‑earth oxide powder has narrow nano‑sized particle distribution, moderate hardness and excellent chemical‑mechanical reactivity. It serves as precision lapping abrasive for CPO wafer, optical glass and component end‑face finishing, delivering low‑scratch surface quality for high‑performance optoelectronic assembli

Product Detail

Product Detail PageNano Cerium Oxide Polishing Powder CAS 1306‑38‑3, for CPO Wafer Glass Optical End‑Face Precision LappingThis nano cerium oxide polishing powder is produced via refined wet‑chemical precipitation of rare‑earth salt precursors, followed by low‑to‑medium temperature calcination, jet de‑agglomeration and multi‑stage fractional classification. Strict synthesis parameters are controlled to obtain narrow nano particle‑size distribution. Heavy‑metal and insoluble coarse grit impurities are rigorously eliminated to avoid micro‑scratch defects during precision lapping operations, which is critical for optoelectronic and CPO component manufacturing.

In CPO‑related wafer lapping processes, the nano ceria particles provide synergistic chemical etching and gentle micro‑mechanical abrasion. It removes surface damage layers generated during previous cutting and grinding steps. The ultrafine particle dimension helps to minimize subsurface damage on wafer substrates, which directly reduces optical loss for high‑speed optoelectronic chips inside CPO modules. Well‑controlled surface roughness guarantees consistent subsequent thin‑film deposition and chip bonding performance.

For optical glass and optical end‑face precision lapping, this nano cerium oxide abrasive is formulated into polishing slurry for end‑face finishing of optical fibers, light‑guide blocks and glass prism components deployed in CPO systems. It eliminates micro‑chips, grinding marks and tiny surface defects on optical end‑faces. Superior scratch‑free surface quality effectively suppresses light scattering at the end‑face, stabilizing optical transmission efficiency of the whole optoelectronic module.

Surface dispersion treatment can be applied to nano cerium oxide powder. The surface modification suppresses hard agglomeration of nano‑particles in aqueous or solvent‑based polishing slurries, improving long‑term suspension stability and uniform abrasive distribution. It can be compounded with suitable dispersants, pH adjusting agents and auxiliary surfactants to prepare custom‑grade precision lapping slurries for different optical substrate materials.

The nano cerium oxide polishing powder must be stored in hermetically sealed dry packaging. Humid storage conditions will trigger irreversible hard agglomeration of nano‑particles; agglomerated large grits will produce severe micro‑scratches on delicate optical end‑faces and wafers. During weighing, transfer and batching operations, cross‑contamination with coarse hard ceramic grits should be strictly prevented. Even a tiny amount of foreign coarse abrasive will ruin the precision‑lapped optical surfaces. This nano cerium oxide polishing powder is a high‑performance rare‑earth nano abrasive dedicated to CPO wafer, optical glass and optical end‑face precision lapping within optoelectronic manufacturing.

Previous : Cerium Oxide Powder High-Purity CAS 1306-38-3, for CPO Optical Module Filler CMP & Glass Polish Next : CPO Encapsulation Compound Epoxy/Silicone Resin with Spherical Filler, for Co-Packaged Optics Sealing Moisture Insulation

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

Nano Cerium Oxide Polishing Powder CAS 1306-38-3, for CPO Wafer Glass Optical End-Face Precision Lapping

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.