Cerium Oxide Powder High-Purity CAS 1306-38-3, for CPO Optical Module Filler CMP & Glass Polish
High‑purity cerium oxide powder, CAS 1306‑38‑3. Produced by rare‑earth precipitation, calcination, pulverization and precise classification. This rare‑earth oxide powder possesses outstanding chemical‑mechanical polishing performance, UV‑shielding capacity and good chemical inertness. It serves as multi‑functional material for CPO optical module resin filler, CMP chemical‑mechanical polishing and industrial glass polishing applications in optoelectronic manufacturing.
Product Detail PageCerium Oxide Powder High‑Purity CAS 1306‑38‑3, for CPO Optical Module Filler CMP & Glass PolishingThis high‑purity cerium oxide powder is manufactured from refined rare‑earth feedstock via precipitation, high‑temperature calcination, milling and multi‑stage air classification. Strict calcination and particle‑size control regulate crystal morphology and polishing activity. Heavy‑metal and residual impurity contents are tightly controlled to satisfy optoelectronic‑grade requirements for semiconductor and optical component production.
When used as functional filler for CPO optical module resin systems, cerium oxide powder is dispersed inside epoxy or silicone matrix. Its UV‑absorbing characteristic suppresses photo‑aging of polymer encapsulation materials under long‑term laser irradiation within CPO assemblies. The rigid cerium oxide particles increase the hardness and modulus of cured resin, reduce thermal expansion coefficient of the composite, and enhance dimensional stability of optical module encapsulation parts, helping to maintain stable optical alignment during temperature cycling.
For CMP chemical‑mechanical polishing applications, this cerium oxide grade acts as key abrasive component inside polishing slurries. It provides moderate mechanical cutting together with weak chemical etching effect, enabling controlled material removal on wafer and optical substrate surfaces. It delivers consistent removal rates while minimizing deep scratches on delicate optical surfaces.
In industrial glass polishing processes, the powder provides efficient micro‑abrasive action for flat glass, optical lens and precision glass element finishing. It removes surface defects and achieves required surface roughness for finished glass components used within optoelectronic systems.
Custom surface coating treatment is available for this cerium oxide powder. Surface modification improves powder dispersion inside organic resin, reduces sedimentation tendency in resin and polishing slurry. It can be blended with other inorganic fillers to develop custom composite formulations for CPO encapsulation. For CMP usage, it can be matched with dispersants and pH regulators to prepare finished polishing slurries according to targeted wafer‑processing specifications.
This cerium oxide powder should be stored in sealed, dry packaging to avoid moisture absorption and hard agglomeration. During batching and conveying workflows, cross‑contamination with hard coarse mineral abrasives must be prevented. Hard foreign grit will introduce severe scratches on polished optical surfaces and degrade the optical performance of CPO module encapsulation composites. This high‑purity cerium oxide powder is a versatile rare‑earth oxide material for CPO optical module filling, semiconductor CMP processing and precision industrial glass polishing.
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