Near‑Spherical Single‑Crystal Alumina CAS 1344‑28‑1, for TIM CPO Thermal Grease & High‑Thermal Conductive Filler
Near‑Spherical Single‑Crystal Alumina, CAS 1344‑28‑1. It is produced by high‑temperature crystal growth, controlled crushing and precise classification. This single‑crystal alumina exhibits near‑spherical particle morphology without full spheronization. It acts as high‑thermal‑conductive inorganic filler for TIM thermal interface materials, CPO thermal grease and polymer thermal composites, improving thermal conductivity while maintaining good fluidity of grease and paste‑type thermal systems.
Product Detail PageNear‑Spherical Single‑Crystal Alumina CAS 1344‑28‑1, for TIM CPO Thermal Grease & High‑Thermal Conductive FillerThis near‑spherical single‑crystal alumina is manufactured through high‑temperature single‑crystal crystallization, targeted comminution and multi‑stage air classification. The material maintains complete alpha‑alumina single‑crystal lattice. Particles show near‑spherical contour instead of perfectly spherical beads, balancing high crystal thermal conductivity and favorable rheological behavior. Strict classification removes oversized sharp fragments that would cause excessive abrasion on mixing equipment and chip surfaces.
Different from fully fused spherical alumina, this single‑crystal grade retains superior intrinsic crystal thermal conductivity. Its rounded‑edge near‑spherical morphology reduces particle interlocking effect inside grease and paste matrices. Higher filler loading can be achieved without sharp viscosity build‑up of thermal grease, which is critical for formulating high‑performance TIM products.
In CPO semiconductor thermal‑grease applications, this alumina filler forms continuous heat‑conducting pathways within silicone‑based thermal grease. It fills tiny microscopic gaps between high‑power CPO chips and heat‑sink assemblies, lowering interfacial thermal resistance and efficiently transferring operating heat away from chip surfaces. Well‑controlled ionic impurity levels reduce the risk of electrochemical migration under high‑temperature‑humidity service environments, protecting the long‑term reliability of advanced semiconductor packaging modules.
For general high‑thermal conductive composite systems, this near‑spherical single‑crystal alumina can be blended with fine or coarse thermal fillers to build graded particle‑size distribution. Optimized grading further increases maximum filling fraction and improves bulk thermal conductivity of cured thermal‑conductive resins.
Custom silane surface modification is available. Surface treatment enhances the interfacial affinity between alumina particles and silicone or epoxy polymer base, improving dispersion stability of thermal grease and suppressing oil separation phenomenon during long‑term storage and thermal cycling.
The powder shall be hermetically sealed and stored under dry conditions to avoid moisture absorption. During material weighing, conveying and compounding, cross‑contamination with sharp‑edged crushed alumina must be strictly avoided, otherwise excessive abrasion will occur in thermal grease formulations. This near‑spherical single‑crystal alumina is a premium thermally‑conductive inorganic filler for TIM thermal interface materials, CPO thermal grease and high‑performance thermal‑management polymer composites for the semiconductor and electronics industries.
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