4N ultrafine alpha alumina powder, CAS 1344‑28‑1, D50 ≤0.15 μm. It is produced by high‑temperature controlled calcination, ultrafine milling and multi‑stage purification. This high‑purity α‑Al₂O₃ powder features fine primary particle dimension and high sintering activity. It is used as reinforcing filler for CPO nanocomposite and raw material for high‑end technical ceramic, improving mechanical strength, thermal stability and electrical insulation of finished electronic components.
Product Detail PageUltrafine Alpha Alumina Powder 4N CAS 1344‑28‑1, D50 ≤0.15μm for CPO Nanocomposite & High‑End CeramicThis 4N ultrafine alpha alumina powder is manufactured from high‑purity aluminium‑based precursors via precisely controlled high‑temperature calcination for alpha‑phase crystal transformation, followed by ultrafine grinding and multi‑stage classification purification. The median particle size D50 is controlled ≤0.15 μm. Rigorous fractionation eliminates coarse residual particles and hard agglomerates, ensuring narrow particle‑size distribution and consistent powder quality. Low levels of alkali‑metal and heavy‑metal impurities are achieved through dedicated purification workflows to satisfy strict requirements of high‑end electronic‑grade materials.
For CPO nanocomposite applications, the ultrafine alumina powder is dispersed inside thermoset or thermoplastic polymer matrices. Well‑distributed nano‑micro alumina particles act as rigid reinforcing phases. They improve composite modulus, surface hardness and thermal conductivity, while restraining thermal expansion of polymer resin. The fine particle dimension avoids severe abrasion on precision circuit structures of CPO packaging assemblies. Low ionic impurity content minimizes electrochemical migration risk under high‑temperature and humid working conditions, preserving long‑term electrical reliability for advanced semiconductor packages.
When deployed for high‑end ceramic production, the ultrafine powder exhibits outstanding sintering activity. It can reduce sintering temperature and promote uniform densification during firing cycles. The resultant sintered ceramic parts feature high density, excellent mechanical strength, good wear‑resistance and superior electrical insulation. It is suitable for manufacturing precision ceramic substrates, insulating components and ceramic structural parts for optoelectronic and semiconductor devices.
Surface modification treatment can be performed upon request. For polymer nanocomposite formulas, silane surface treatment improves powder dispersion within organic resin and reduces the formation of hard agglomerates during compounding. For ceramic slurry preparation, dispersant‑assisted processing helps to achieve stable suspension and uniform green body forming.
Due to extremely fine particle size, this ultrafine alumina powder has large specific surface area and is susceptible to moisture‑induced agglomeration. Hermetic sealed storage under low‑humidity environment is required. During weighing, milling and batching processes, cross‑contamination with ordinary lower‑purity alumina grades must be strictly prevented to maintain the 4N high‑purity specification. This ultrafine 4N alpha alumina powder serves as premium raw material for CPO polymer nanocomposite and high‑performance technical ceramic manufacturing in the semiconductor and electronics industry.

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