Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding

Name: Epoxy Molding Compound Internal Release Agent, No Impact on Packaging Reliability & Wire Bonding
Rating: 4.5 (85 reviews)

Epoxy Molding Compound Internal Release Agent is a high‑purity functional processing additive designed for epoxy molding compound in semiconductor IC encapsulation. It shows moderate compatibility with epoxy resin, curing agent and fused silica filler system. During high‑temperature transfer molding, only a controlled portion migrates towards the mold interface to build an ultra‑thin lubricating isolating layer for clean demolding. Optimized molecular structure effectively restrains excessive su

Product Detail

Product Detail Page: This EMC internal release agent is manufactured by targeted organic synthesis and high‑purity refining. Low‑molecular‑weight components and trace metallic ions are removed via vacuum distillation and fine filtration. Every production batch undergoes strict quality inspection, including melting point test, thermal stability test, epoxy compatibility assessment, mold‑release efficiency, wire‑bonding strength test, solderability evaluation and high‑humidity accelerated ageing test before delivery.

Semiconductor IC encapsulation by epoxy transfer molding puts forward extremely rigorous standards for internal processing additives. Ordinary general‑purpose release agents tend to over‑migrate under high‑temperature molding conditions, forming a contaminant film on the outer surface of molded packages. Such surface contamination severely reduces wire‑bonding adhesion strength, deteriorates solder wetting behaviour, and triggers package delamination under thermal‑humidity shock. These defects bring serious hidden reliability risks for finished semiconductor devices. If the release capacity is insufficient, cured epoxy molding compound adheres firmly to precision mold cavities, resulting in package chipping, edge cracking and frequent mold cleaning. Some release additives also disturb epoxy cross‑linking curing reaction, changing curing speed and degrading the mechanical performance of cured encapsulation materials.

When this internal release agent is homogeneously kneaded into the EMC formulation at recommended loading, it maintains uniform dispersion inside uncured epoxy matrix. Under high‑temperature and high‑pressure conditions in transfer molding tools during encapsulation cycles, only a limited quantity of the additive migrates toward the mold surface and creates an ultra‑thin lubricating boundary film. This interfacial film lowers the adhesion force between cured epoxy molding compound and mold steel to achieve smooth demolding of finished IC packages. The majority of additive remains dispersed within the cured epoxy network. It will not hinder epoxy cross‑linking curing, avoids harmful surface blooming, preserves wire‑bonding performance, solderability and anti‑humidity property, and guarantees long‑term packaging reliability for semiconductor components.

Accurate dosage control is critical during EMC compounding. Under‑dosage leads to insufficient releasing performance, package sticking, chipping and higher mold‑cleaning frequency. Excessive addition causes undesirable surface blooming, weakens wire‑bonding and soldering properties, and introduces latent reliability hazards for encapsulated chips. Complete verification including molding trial, wire‑bonding testing and accelerated ageing reliability evaluation shall be finished prior to large‑scale EMC production. This release agent can be compounded with epoxy resin, curing agents, fused silica fillers and other functional additives for electronic‑grade epoxy molding compound.

For processing operations, meter the release agent and feed it into high‑speed mixing and kneading equipment during EMC compound preparation under low‑dust electronic‑grade production environment.

Major application fields: internal release additive for transfer‑molding epoxy molding compound for logic IC, memory chip and power semiconductor; functional processing auxiliary for high‑reliability semiconductor packaging materials; non‑interfering lubricant for EMC formulation development.

Store the product in tightly‑sealed original packaging within 15‑25℃, maintain low‑dust dry warehouse conditions, avoid direct sunlight and long‑term thermal exposure.

Previous : Mold Anti-Carbon Release Agent High-Temp Ester-Modified Silicone, Reduce Mold Cleaning for Rubber & Plastic Next : High-Temp Encapsulation Release Powder Montan Wax/PTFE Blend, 300℃+ Low Bleed for Electronic Packaging

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now