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Semi-Permanent Epoxy Release Agent Solvent-Based Fluorosilicone, High-Gloss No Residue for FRP Composite Molding

This solvent‑based semi‑permanent release agent adopts fluorosilicone active ingredient dissolved in volatile organic solvent system, combined with leveling additives. When applied onto clean mold surfaces, the solvent evaporates rapidly, depositing a tough, uniform fluorosilicone release coating. The durable separating layer allows successive molding cycles before re‑application is required. It is suitable for epoxy resin casting and FRP composite molding. It helps composite parts to obtain con

Product Detail Page: The fluorosilicone active substance is dissolved in carefully selected volatile solvent under controlled mixing conditions. Leveling agents are incorporated to promote uniform spreading over metallic, gel‑coated and composite mold surfaces. Filtration steps eliminate insoluble micro‑particles. The finished liquid shows good storage stability and provides excellent wetting performance on smooth mold tooling.

FRP and epoxy composite manufacturing faces persistent challenges with mold release. Conventional temporary release wax needs frequent re‑coating after each molding cycle, which severely lowers production efficiency. Many common silicone‑based release agents leave silicone residues on composite surfaces. Such residual contamination leads to fish‑eyes, craters and poor adhesion during subsequent painting, gel‑coating or bonding operations. It is costly and labor‑intensive to remove release‑agent residues from composite parts.

After thorough cleaning of the mold surface, this solvent‑based fluorosilicone release agent is brushed or wiped evenly. Volatile solvent evaporates quickly at room temperature, curing into a continuous tough fluorosilicone barrier film on the mold. The low‑surface‑energy coating provides effective anti‑adhesion against liquid epoxy resin and wet FRP resin matrix during curing. Several consecutive molding runs can be completed before re‑coating becomes necessary, which defines its semi‑permanent working property. Molded FRP and epoxy composite components achieve brilliant high‑gloss surface quality. Compared with standard dimethyl‑silicone release agents, fluorosilicone greatly reduces migration onto composite workpieces, lowering residue‑related defects in post‑finishing.

Even though it features semi‑permanent performance, gradual wear of the release film is inevitable after repeated molding cycles. Operators should monitor demolding behavior and surface gloss of molded parts. Once sticking tendency or surface haze appears on finished components, the mold shall be cleaned and re‑coated. Over‑application must be avoided; excess thick coating may cause tiny surface blemishes on the glossy composite surface.

For workshop operation, completely strip old release residues and polish the mold before first coating. Apply the release agent in several thin coats with sufficient flash‑off time between each coat. Allow full curing of fluorosilicone film prior to starting composite lamination. Since the formulation contains flammable solvent, ensure adequate workshop ventilation and strictly eliminate ignition sources.

Prevent foreign particulate contamination, prolonged high‑temperature storage and direct sunlight. Heat will accelerate solvent loss and alter the solution composition.

Major application fields: semi‑permanent mold release for hand lay‑up FRP parts; vacuum infusion and compression molding of epoxy‑based composite components; high‑gloss composite molding for industrial composite workshops.

Store the product in tightly‑sealed original metal drums within 10‑30℃. Keep away from open flame, sparks and direct sunlight. Do not seal under excessive pressure.


Semi-Permanent Epoxy Release Agent Solvent-Based Fluorosilicone, High-Gloss No Residue for FRP Composite Molding
This solvent‑based semi‑permanent release agent adopts fluorosilicone active ingredient dissolved in volatile organic solvent system, combined with leveling additives. When applied onto clean mold surfaces, the solvent evaporates rapidly, depositing a tough, uniform fluorosilicone release coating. The durable separating layer allows successive molding cycles before re‑application is required. It is suitable for epoxy resin casting and FRP composite molding. It helps composite parts to obtain con
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Semi-Permanent Epoxy Release Agent Solvent-Based Fluorosilicone, High-Gloss No Residue for FRP Composite Molding

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Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.


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