Thermal Grease Heat Sink Compound 0.7W/mK CAS 63148-62-9, Non-Melt White for PCB IGBT Electronic Heat Dissipation
This 0.7W/mK white thermal grease heat sink compound is a silicone‑based thermal interface material. With non‑melt characteristic, it fills micro‑irregularities between heat‑generating electronic chips and heat sinks. It reduces thermal contact resistance on PCB and IGBT assemblies, conducts waste heat rapidly away from hot components, and delivers stable long‑term electronic heat dissipation performance under continuous operating loads.
Product DetailsThermal Grease Heat Sink Compound 0.7W/mK CAS 63148‑62‑9, Non‑Melt White for PCB IGBT Electronic Heat DissipationThis white thermal grease is produced using polydimethylsiloxane base carrier combined with selected thermally conductive inorganic fillers. It features a moderate paste‑like consistency and exhibits non‑melt behaviour across the designed service temperature range, preventing grease flowing or dripping away from the interface after prolonged equipment running.
When thinly spread between IGBT chips, PCB power components and corresponding heat sinks, the compound fills tiny surface valleys and gaps that exist on machined metal surfaces. It eliminates trapped air pockets which act as thermal insulators, lowering overall thermal contact resistance and facilitating continuous transfer of operating heat out of electronic assemblies. The white colour enables visual inspection during manual dispensing and smearing operations for quality control during product assembly.
The grease shows good compatibility with common PCB substrates, metal heat sink alloys and plastic housing materials. It will not corrode copper or aluminium heat sink surfaces, and does not induce stress cracking of adjacent plastic elements. It maintains stable rheology after cyclic temperature fluctuations, resisting oil separation and filler sedimentation under normal service conditions.
Typical application scenarios include power IGBT modules on printed circuit boards, small‑scale power regulators, switching power supplies and general consumer‑grade electronic heat dissipation. It is designed for thin‑layer manual or automated dispensing during component assembly. Excessive thick coating should be avoided because over‑application will increase thermal resistance and weaken heat‑dissipation efficiency. Do not mix this thermal grease with other lubricants or greases. Store in tightly sealed original packaging in cool, dry indoor conditions. Avoid prolonged high‑temperature storage to prevent base fluid separation and maintain consistent thermal performance for subsequent production usage.
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