Thermal Grease Medium Thermal Conductivity 3.2W/mK CAS 63148-62-9, Non-Cure for MPU Power Module TIM1 TIM2
This 3.2W/mK medium thermal conductivity thermal grease is a non‑curing silicone‑based thermal interface compound. It is specially engineered to serve as TIM1 and TIM2 material for MPU and power module assemblies. The grease conforms to uneven mating surfaces, eliminates trapped air gaps between heat‑generating chips and heat dissipating structures, lowers thermal contact resistance, and sustains reliable continuous heat dissipation during long‑duration module operation.
Product DetailsThermal Grease Medium Thermal Conductivity 3.2W/mK CAS 63148‑62‑9, Non‑Cure for MPU Power Module TIM1 TIM2This non‑curing thermal grease adopts purified silicone base oil blended with high‑performance thermally conductive inorganic fillers through sophisticated dispersion processing. It maintains soft paste rheological property throughout the working temperature range without cross‑linking, hardening or curing after application. The paste can deform under moderate clamping pressure to form an extremely thin thermal transfer layer between mating hardware surfaces.
When used as TIM1 directly between MPU die and integrated heat spreader, the grease fills micro‑surface irregularities of the die and spreader. It removes insulating air voids and facilitates rapid heat conduction out of the chip core. Deployed as TIM2 between integrated heat spreader and external heat sink, it further bridges the thermal interface of power modules, helping dissipate accumulated operating heat.
The formulation exhibits good thermal stability against repeated thermal cycling caused by power‑on and power‑off cycles of the processor. It resists filler sedimentation and oil bleeding under sustained thermal load, reducing the risk of thermal performance degradation over the service lifespan of power modules. It is chemically compatible with aluminium and copper heat sinks, metal heat spreaders and common printed circuit board substrates, and will not induce metallic corrosion.
This thermal grease supports automated dispensing for mass module assembly as well as manual application for prototype maintenance. Strict control over coating thickness is required; excessively thick grease layers will raise overall thermal resistance and weaken cooling efficiency. It shall not be mixed with other types of thermal pastes or lubricating greases, incompatible blending will destroy filler dispersion and downgrade thermal conductivity performance. Store the sealed containers in cool, dry indoor warehouse, avoid direct sunlight and long‑term high‑temperature storage to keep original paste property for electronic module production.
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Thermal Grease Medium Thermal Conductivity 3.2W/mK CAS 63148-62-9, Non-Cure for MPU Power Module TIM1 TIM2
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