High-Thermal Conductivity Grease 4.3W/mK CAS 63148-62-9, Low Thermal Resistance for CPU GPU Power Semiconductor TIM
This 4.3W/mK high‑thermal‑conductivity grease is a silicone‑based thermal interface compound with low thermal resistance. Optimized filler dispersion delivers superior heat transfer performance. It fills microscopic surface irregularities between chips and heat sinks, expels trapped air, and provides consistent TIM performance for CPU, GPU and power semiconductor components under high‑load continuous operating conditions.
Product DetailsHigh‑Thermal Conductivity Grease 4.3W/mK CAS 63148‑62‑9, Low Thermal Resistance for CPU GPU Power Semiconductor TIMManufactured from refined silicone base fluid combined with high‑grade thermally conductive inorganic fillers under precise dispersion and grinding processes, this high‑thermal‑conductivity grease maintains a smooth, non‑solidifying paste consistency. It does not cure or harden after application, allowing the material to flow slightly under assembly clamping pressure to form an ultra‑thin thermal transfer layer.
When deployed as thermal interface material for CPU and GPU processors, the grease conforms to the micro‑roughness of the die surface and the base of the heat sink. It eliminates insulating air pockets existing on mating interfaces, effectively lowering overall thermal contact resistance and quickly transferring concentrated chip heat toward the heat sink. For discrete power semiconductors including power transistors and thyristors mounted on metal heat‑dissipation bases, this thermal grease creates a continuous thermal conduction pathway to prevent localized overheating and thermal runaway.
The grease possesses outstanding thermal‑cycling resistance. After repeated temperature swings caused by device startup and shutdown, it maintains stable rheological behaviour and resists oil separation and filler precipitation. It shows good chemical inertness toward copper, aluminium alloy heat sinks, PCB substrates and common packaging plastics, without inducing metal corrosion or polymer degradation.
This thermal grease is suitable for automated dispensing in large‑scale electronics manufacturing as well as manual rework and maintenance operations. The coating thickness must be kept as thin as possible; excessive spreading will increase thermal resistance and degrade cooling results. Mixing with other thermal greases or general lubricating greases is prohibited. Incompatible blending will disrupt uniform filler distribution and reduce thermal conductivity. Store the product in tightly sealed original containers within a cool, dry indoor environment. Avoid sustained high‑temperature storage and direct sunlight to preserve paste property and consistent thermal performance for electronic assembly.
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High-Thermal Conductivity Grease 4.3W/mK CAS 63148-62-9, Low Thermal Resistance for CPU GPU Power Semiconductor TIM
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