Wafer Release Agent Fluorosilicone is a high‑purity fluorinated silicone formulated for semiconductor precision manufacturing. With excellent thermal stability and low surface‑tension properties, this specialty release material forms an ultra‑thin temporary isolating film on wafer surfaces. It delivers reliable releasing performance during wafer dicing and wafer‑back grinding procedures. It minimizes residual contamination on wafer substrates, avoids interference to subsequent photolithography,

Product Detail

Product Detail Page: This fluorosilicone wafer release agent is synthesized via controlled fluorosilicone polymerization followed by multi‑stage filtration and purification to remove metal‑ion impurities and volatile fractions. Finished material undergoes strict quality inspection including viscosity testing, non‑volatile content, ionic impurity analysis, thermal stability test and wafer release performance verification before shipment.

Semiconductor wafer dicing and back‑grinding processes impose extremely stringent requirements on processing auxiliaries. Conventional silicone‑based release materials tend to leave heavy silicone residues on wafer surfaces. Residual contaminants cause severe defects in subsequent photoresist coating, plasma etching and metal bonding steps, resulting in scrap wafers. During mechanical grinding, the wafer needs temporary adhesion and controlled release from carrier tape or grinding fixture. Improper release performance may lead to wafer chipping, micro‑cracks and edge damage, which directly reduces finished‑chip yield. General industrial release agents also contain unacceptable trace metal ions that may induce electrical leakage inside semiconductor devices.

When applied onto fixture or wafer carrier surface by precise dispensing, spraying or spin‑coating method, the fluorosilicone release agent spreads uniformly and creates an ultra‑thin temporary isolating layer. This thin isolating film provides controlled interfacial slippage and releasing effect. After completion of wafer grinding and dicing operations, the wafer can be detached smoothly from the carrier without mechanical shock. Thanks to optimized molecular structure, this fluorosilicone formulation greatly suppresses stubborn residual contamination on wafer substrate. It maintains stable performance under frictional heat generated during high‑speed grinding. It does not introduce harmful metal‑ion impurities, and will not interfere with downstream semiconductor manufacturing workflows including lithography, deposition and die‑bonding.

Strict usage dosage and coating thickness control are critical for semiconductor production. Insufficient coating thickness causes poor releasing behaviour; wafer sticking occurs and leads to wafer breakage during demolding or releasing. Excessive coating thickness increases the risk of trace fluorosilicone residue contamination on wafer surface, which negatively impacts subsequent chip fabrication. Process validation on actual wafer production line is strongly recommended before formal mass adoption. This fluorosilicone release agent can be used together with high‑purity semiconductor processing fluids for wafer grinding and dicing procedures.

For processing operations, the product can be applied via spin coating, fine spraying or dipping according to actual wafer‑fabrication process specifications. The working environment shall maintain high‑level clean‑room conditions.

Major application fields: temporary release processing auxiliary for silicon wafer back‑grinding in semiconductor manufacturing; release treatment agent for wafer dicing carrier fixtures; precision electronic processing fluorosilicone auxiliary for chip‑fabrication clean‑room workflow.

Store the product in tightly‑sealed original containers within 15‑25℃, keep dry, avoid direct sunlight and dust contamination in clean‑room warehouse.

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Wafer Release Agent Fluorosilicone, Semiconductor Wafer Dicing & Grinding Precision Electronic Processing

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.