High-Thermal Boron Nitride Powder h-BN CAS 10043-11-5, for CPO Thermal Filler & BN Molded Product Raw Material
High‑thermal boron nitride powder h‑BN, CAS 10043‑11‑5. It is produced by high‑temperature solid‑state synthesis, thermal annealing, purification and particle classification. This flaky hexagonal boron nitride powder features outstanding thermal conduction performance, low dielectric constant and excellent high‑temperature resistance. It can be used as functional thermal filler for CPO resin‑based packaging composites, and also as sintering feedstock for hot‑pressed BN molded ceramic parts for o
Product Detail PageHigh‑Thermal Boron Nitride Powder h‑BN CAS 10043‑11‑5, for CPO Thermal Filler & BN Molded Product Raw MaterialThis high‑thermal hexagonal boron nitride powder is manufactured via high‑temperature solid‑state reaction between boron‑containing precursors and nitrogen. Subsequent thermal annealing promotes complete crystal growth of flaky h‑BN platelets. The crude powder is subjected to purification, de‑agglomeration and multi‑stage air classification. Strict quality control minimizes residual boron oxide and metallic impurities to meet electronic‑grade requirements for both composite filling and ceramic sintering applications.
When applied as CPO thermal filler, the flaky h‑BN platelets are dispersed inside epoxy, silicone or potting resin matrices. The platelets construct effective thermal conduction networks within cured polymer composites, dissipating localized hot‑spots generated by high‑density optical chips of CPO modules. Benefiting from inherent electrical insulation and low dielectric loss, the filler maintains stable dielectric performance under continuous operating voltage. It reduces the overall coefficient of thermal expansion of encapsulation resin, mitigates cyclic thermal‑mechanical stress, and lowers the risks of delamination and micro‑cracking inside optoelectronic packaging.
As raw material for BN molded products, this h‑BN powder is mixed with suitable sintering auxiliaries before hot‑press forming and high‑temperature sintering. The finished boron nitride molded components exhibit outstanding high‑temperature stability, excellent thermal‑shock resistance, reliable electrical insulation and moderate machinability. These BN molded parts can be used as insulating spacers, heat‑conducting positioning components and release inserts inside optoelectronic and semiconductor equipment.
Custom silane surface modification is available for this h‑BN powder. Surface treatment improves the wetting property between boron nitride flakes and organic polymer matrices, reduces particle agglomeration during resin compounding, and enhances interfacial bonding within cured composites. For encapsulation formulations, this powder can be blended with spherical alumina, aluminum nitride or graded boron nitride fractions to create multi‑modal hybrid filler systems for tuning viscosity, maximum loading and thermal‑mechanical properties of CPO packaging materials.
This boron nitride powder requires hermetically sealed dry storage to avoid moisture‑induced agglomeration of flaky particles. During material handling, severe mechanical shearing should be avoided to prevent excessive particle fragmentation. Cross‑contamination with other oxide‑based ceramic powders must be strictly controlled in batching processes. Foreign impurities will degrade sintering performance for BN molded ceramic parts and reduce insulation reliability of CPO encapsulation composites. This high‑thermal h‑BN powder is a versatile ceramic material suitable for CPO thermal filler production and the manufacturing of hot‑pressed boron nitride molded components for optoelectronic and semiconductor industries.
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