Spherical agglomerated boron nitride filler, CAS 10043‑11‑5, D50 35‑300 μm. It is produced by granulating fine hexagonal boron nitride flakes with temporary binder, thermal sintering and post‑sieving classification. Each spherical granule consists of tightly packed h‑BN micro‑flakes. This filler combines high thermal conductivity, outstanding flow‑ability and reliable dielectric insulation. It is used for CPO potting resin and dielectric composite formulations, enabling high filler loading and i

Product Detail

Product Detail PageSpherical Agglomerated Boron Nitride Filler CAS 10043‑11‑5, D50 35‑300μm High‑Flow for CPO Potting & DielectricThis spherical agglomerated boron nitride filler is fabricated from fine hexagonal boron nitride flake feedstock. The manufacturing workflow includes slurry preparation, spray granulation, high‑temperature thermal treatment to remove organic binders, sintering consolidation and multi‑range sieving classification. Median particle size D50 is controlled within 35‑300 μm. Each individual spherical granule is an aggregate built from numerous tiny h‑BN platelets. Strict purification limits boron‑oxide and metallic impurities to satisfy electronic‑grade requirements for semiconductor and optoelectronic applications.

Unlike raw flaky hexagonal boron nitride which tends to orient within resin and cause anisotropic thermal performance, the spherical agglomerated particle morphology greatly improves powder flow characteristics. During compounding with epoxy or silicone potting resin, this filler permits significantly higher solid loading without excessive viscosity rise. The improved rheological behavior facilitates mold filling and reduces void formation for thick‑layer potting in CPO optical modules. Internal h‑BN flake networks inside each granule still preserve excellent intrinsic thermal conduction capacity, helping to build three‑dimensional thermal pathways throughout the cured potting matrix.

For CPO dielectric potting applications, the filler maintains stable dielectric properties under varying operating temperatures. It provides reliable electrical insulation for densely arranged optical chips and circuit traces, while spreading away accumulated heat from high‑power optoelectronic devices. It reduces the coefficient of thermal expansion of the potting composite, alleviating thermal‑cycling‑induced internal stress and lowering the probability of delamination, micro‑cracking and package failure in long‑running data‑center CPO systems.

Custom silane surface modification is available for spherical agglomerated BN granules. Surface coating enhances interfacial wetting and bonding between ceramic aggregates and polymer resin matrix. It reduces interfacial voids, improves moisture‑resistance and elevates mechanical strength of cured potting parts. This filler can be blended with fine h‑BN powder, spherical alumina or aluminum nitride to construct multi‑modal particle‑size grading systems. Formulators are able to adjust maximum loading, resin fluidity, thermal conductivity and dielectric performance for tailor‑made CPO potting and dielectric encapsulation recipes.

The spherical agglomerated boron nitride filler should be stored in hermetically sealed dry packaging. Excessive mechanical impact during handling must be avoided, because the sintered aggregates may break down into fine flakes under strong shear force. Particle fracture would deteriorate the designed high‑flow rheological performance of potting formulations. During batching and conveying, cross‑contamination with sharp‑edged coarse ceramic particles needs to be prevented. This spherical agglomerated boron nitride filler is a premium high‑flow thermally conductive dielectric filler for CPO potting and high‑reliability optoelectronic packaging composites.

Previous : Hexagonal Boron Nitride Powder Coarse CAS 10043-11-5, D50 8.5μm for CPO High-Thermal Filler & Isotropic Potting Next : High-Thermal Boron Nitride Powder h-BN CAS 10043-11-5, for CPO Thermal Filler & BN Molded Product Raw Material

Copy product links

Long by picture save/share

Add Successfully

Continue To Visit Inquiry Now

Spherical Agglomerated Boron Nitride Filler CAS 10043-11-5, D50 35–300μm High-Flow for CPO Potting & Dielectric

enquiry

Add Successfully

Continue To Visit Inquiry Now

Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.