JSYAPG‑HS30 colloidal silica slurry is water‑based amorphous silica sol featuring average particle size of 12 nm and 30 wt% SiO₂ solid content. The spherical silica nanoparticles adopt electrostatic stabilization system. It balances performance and cost for general‑industrial usage. This silica sol can be applied for glass polishing, stone surface consolidation, as well as conventional chemical‑mechanical polishing. It is available for direct use or further dilution in downstream formulation.

Product Detail

Product Detail Page: JSYAPG‑HS30 colloidal silica slurry consists of amorphous spherical silica nanoparticles evenly dispersed in deionized water medium. Electrostatic repulsion between silica particles suppresses flocculation and sedimentation under recommended storage conditions. Average particle size is controlled at 12 nm with moderate particle‑size distribution, delivering stable physical properties across production batches.

In glass processing applications, the nano‑silica particles serve as mild abrasive media during glass polishing. It improves surface smoothness of flat glass, decorative glass and glass craftwork, removing fine surface blemishes without creating deep scratches.

For natural stone treatment, the silica sol penetrates into micro‑cracks and capillary pores inside stone substrates. After water evaporation, the amorphous silica precipitates inside pores to form rigid silica bonding network. It hardens the stone surface, reduces dusting and enhances weathering resistance of building stone.

Within general‑grade CMP processes, the spherical particles provide steady material‑removal performance for non‑semiconductor planarization tasks. It works well for ceramic substrate polishing and ordinary hard‑surface planarization.

The slurry keeps stable viscosity under ambient temperature. It can be diluted with deionized water to lower solid content based on different formulation requirements. Extreme environments including strong acid, sustained high temperature and freezing must be avoided. These conditions will destroy colloidal stability and cause irreversible gelation and silica precipitation.

Main application areas include architectural stone surface hardening treatment, decorative glass polishing, ceramic substrate planarization, general‑purpose CMP processing, and inorganic coating binder.

Store in tightly‑sealed original plastic containers within 5‑35℃. Protect from direct sunlight and freezing conditions. Standard industrial packaging includes plastic drums and IBC totes for bulk shipment. Periodic gentle circulation is recommended for long‑term stock to slow down bottom sediment accumulation.

Previous : (JSYAPG-LS) Colloidal Silica Slurry Low-Sodium 12nm 30% CAS 112926-00-8, Low-Metal Nano Silica for Semiconductor Polishing Next : (JSYAPG-HS40) Colloidal Silica Slurry High-Solids 12nm 40% CAS 112926-00-8, CMP Oxide Planarization High Removal Rate

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(JSYAPG-HS30) Colloidal Silica Slurry 12nm 30% SiO₂ CAS 112926-00-8, General-Purpose Silica Sol for Glass, Stone & CMP

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.