JSYAPG‑LS low‑sodium colloidal silica slurry is water‑based amorphous nano‑silica sol with an average particle size of 12 nm and 30 wt% solid content. It is manufactured under strict low‑metal‑ion controlled production conditions to minimize sodium and other residual metallic impurities. Spherical silica nanoparticles provide stable abrasive performance for semiconductor wafer polishing. This liquid silica slurry is suitable for electronic‑grade CMP processes and related high‑purity industrial a

Product Detail

Product Detail Page: JSYAPG‑LS low‑sodium colloidal silica slurry is composed of amorphous spherical silica nanoparticles homogeneously dispersed in deionized water. Special synthesis and purification procedures are implemented during production to strictly lower residual sodium, iron and heavy‑metal ion levels. Electrostatic stabilization maintains particle suspension status and prevents spontaneous agglomeration under proper storage. The average particle diameter is controlled at 12 nm with narrow particle‑size distribution, securing consistent abrasive performance batch after batch.

For semiconductor chemical‑mechanical polishing processes, low‑metal characteristic is critical. Excessive alkali‑metal ions may cause ionic contamination on wafer surfaces, which leads to circuit leakage and reliability defects for finished semiconductor chips. This low‑sodium silica slurry reduces such contamination risks effectively. Moderate particle hardness enables balanced material removal rate and excellent surface planarization effect on wafer substrates. It helps to decrease micro‑scratch incidents during fine polishing steps.

The slurry features stable viscosity under normal temperature. On‑site dilution with ultra‑pure deionized water is permitted according to actual polishing formulation requirements. Strong acidic conditions, high‑temperature exposure and freezing environment shall be strictly avoided. These harsh conditions will break colloidal electrostatic equilibrium and trigger irreversible gelation, flocculation and precipitation of silica particles.

Primary application fields include semiconductor wafer fine CMP polishing, advanced optical element finishing, high‑purity ceramic binder and electronic material auxiliary processing.

Store the product inside tightly sealed original plastic containers within 5‑35℃ storage temperature range. Shield containers from direct sunlight and freezing. Standard industrial packaging options include plastic drums and IBC totes for bulk liquid delivery. For long‑term inventory, gentle periodic circulation is suggested to mitigate bottom sediment generation.

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(JSYAPG-LS) Colloidal Silica Slurry Low-Sodium 12nm 30% CAS 112926-00-8, Low-Metal Nano Silica for Semiconductor Polishing

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.