JSYAPG‑HS40 high‑solids colloidal silica slurry is water‑based amorphous silica sol with average particle size of 12 nm and 40 wt% solid content. Optimized electrostatic stabilization enables high silica loading without particle flocculation. This concentrated silica slurry delivers higher abrasive particle concentration to achieve high removal‑rate performance, mainly applied for oxide‑layer CMP planarization, and it can be diluted to target solid content for custom polishing formulations.

Product Detail

Product Detail Page: JSYAPG‑HS40 high‑solids colloidal silica slurry is formulated with amorphous spherical silica nanoparticles uniformly dispersed within deionized water. Special synthesis and stabilization technology maintains stable suspension at 40% high solid loading. Strong electrostatic repulsion between silica particles inhibits agglomeration and sedimentation under proper storage. Average particle diameter is strictly controlled at 12 nm with narrow particle‑size distribution to guarantee consistent polishing performance between batches.

In oxide CMP planarization processes, higher concentration of spherical silica abrasive particles directly raises the material removal rate on silicon‑based oxide films. It improves production throughput for wafer processing lines. The spherical particle morphology helps to restrain deep micro‑scratches while maintaining aggressive planarizing capability on oxide dielectric layers.

This high‑solids slurry offers formulation flexibility for polishing engineers. Users can dilute the stock slurry with ultra‑pure deionized water to reach desired working solid concentration according to specific CMP process parameters. It supports custom adjustment of removal rate and surface finishing quality.

Harsh conditions must be prevented during handling and storage. Strong acid, sustained over‑heating and freezing will break colloidal electrostatic equilibrium, which leads to irreversible gelation, particle flocculation and hard precipitation. Once gelation occurs, the slurry cannot be restored.

Major application fields include semiconductor oxide‑layer CMP planarization, precision ceramic wafer polishing, optical glass high‑speed planarization and industrial polishing concentrate for abrasive formulation.

Store the product in tightly sealed original plastic containers at 5‑35℃. Avoid direct sunlight and freezing environment. Standard industrial packaging includes plastic drums and IBC totes for bulk liquid transportation. Gentle periodic circulation is strongly recommended for long‑term warehousing to slow down the formation of bottom sediment.

Previous : (JSYAPG-HS30) Colloidal Silica Slurry 12nm 30% SiO₂ CAS 112926-00-8, General-Purpose Silica Sol for Glass, Stone & CMP Next : (JSYAPG-TM50) Colloidal Silica Slurry Large-Particle 22nm 50% CAS 112926-00-8, High-Rate Rough Polish for Wafer & Glass

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(JSYAPG-HS40) Colloidal Silica Slurry High-Solids 12nm 40% CAS 112926-00-8, CMP Oxide Planarization High Removal Rate

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.