JSYAPG‑L90 hydrophilic fumed silica CMP abrasive is a flame‑pyrolysis‑produced inorganic polishing raw material. It features hydrophilic surface property with specific surface area of BET 90m²/g and strictly controlled low‑metal impurities. This fumed silica can be formulated into polishing slurry for optical glass and dense technical ceramic workpieces. The particle size distribution is tightly controlled to minimize coarse grit fraction. It delivers consistent cutting performance while reducin

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Product Detail Page: JSYAPG‑L90 hydrophilic fumed silica is manufactured via high‑temperature flame pyrolysis synthesis. The particle surface retains abundant silanol groups to provide inherent hydrophilic performance. The nominal BET specific surface area is 90m²/g. During production, dedicated classification and purification processes are implemented to remove oversized aggregates and reduce metallic trace contaminants. Rigorous particle‑size screening helps to restrict coarse particle content, which is critical for mitigating scratch defects on brittle substrates.

Optical glass and advanced technical ceramics are widely used in optical modules, sensor components and precision optoelectronic assemblies. During lapping and polishing operations, coarse abrasive particles frequently introduce permanent surface scratches and subsurface micro‑cracks. These flaws deteriorate light transmission performance of optical elements and decrease mechanical strength of ceramic parts, leading to high rejection rates in precision component manufacturing.

This hydrophilic fumed silica exhibits good wettability when dispersed in aqueous slurry systems. It enables homogeneous particle distribution inside polishing slurries. The moderate hardness of silica particles provides balanced mechanical abrasion action. It can gradually remove lapping traces on optical glass and ceramic surfaces without aggressive gouging damage. The low‑metal specification reduces the risk of surface staining and residual metallic contamination on finished workpieces. This abrasive is suitable for independent slurry formulation according to customer‑oriented production recipes.

When preparing polishing slurry, process engineers can adjust solid loading, pH value and auxiliary dispersant dosage based on target substrates and polishing equipment parameters. Downward pressure, platen speed and slurry circulation flow shall also be optimized on polishing machines to obtain ideal surface finishing results.

This powder product shall be protected against moisture and foreign impurity contamination. Long‑term high‑temperature storage should be avoided. Moisture absorption will cause particle agglomeration, which directly increases scratch risk during subsequent polishing application.

Major application fields include raw abrasive for optical glass polishing slurry, formulation of technical‑ceramic finishing slurry, precision lapping material for optoelectronic hard components.

Store the product in sealed original moisture‑proof bags or drums within 5‑30℃. Keep away from direct sunlight and humid environment. Adequate re‑dispersion mixing is recommended before slurry preparation for long‑term stored batches.

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(JSYAPG-L90) Fumed Silica CMP Abrasive Hydrophilic BET 90m²/g CAS 112945-52-5, Low-Metal for Optical Glass & Ceramic Polish

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.